SDM-7100L

Intel® Smart Display Module with Intel® i3-7100U Processor
  • SDM-L, 175W x 100D (mm)
  • Intel® Core™ i3-7100U Processor
  • Dual Channel DDR4, 2 x SO-DIMMs
  • HDMI and DP for dual display outputs
  • 1 x GbE LAN Port
  • Ultra-Fast M.2 with PCIe Gen3 x4 interface
  • 4 x USB 3.2 Gen 1
  • 7th Generation Intel® Core™ Processor
    Intel's blazing fast, feature packed processor family with built-in security is ready to take your productivity, and creativity to the next level. And, by enabling new exciting Windows 10 features, the 7th generation Intel Core processors empower you to unleash your imagination and explore the possibilities.
  • M.2 Onboard Connector
    Providing users PCI-Express connectivity for SSD devices. Delivering up to 10 Gbps data transfer speeds, M.2 offers users considerably faster storage performance than current mSATA and even SATA Revision 3 6Gbps storage devices.
  • SuperSpeed USB 3.0
    With superfast transfer rates of up to 5 Gbps, users are able to experience a theoretical 10x improvement over USB 2.0. Additionally, backwards compatibility with USB 2.0 assures users of long term use of their legacy USB 2.0 devices.
  • Display Port Support
    Selected GIGABYTE motherboards feature DisplayPort, a next generation graphics display interface that delivers up to 10.8 Gbps of bandwidth over standard cables, providing billions of colors with the fastest refresh rates and the greatest color depths.
  • High-Definition Everywhere
    HDMI is a High-Definition Multimedia Interface which provides up to 5Gb/s video transmitting bandwidth and 8-channel high quality audio all through a single cable. Able to transmit superior, uncompressed digital video and audio, HDMI ensures the crispest rendering of digital content up to 1080p without the quality losses associated with analog interfaces and their digital-to-analog conversion. In addition, HDMI is compatible with HDCP (High-bandwidth Digital Content Protection), allowing the playback of Blu-ray/HD DVD and other protected media content.
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Board Size
SDM-Large
175W x 100D (mm)
Operating Properties
Operating temperature: 0°C to +55°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to +85°C
Non-operating humidity: 0%-95% (non-condensing)
Processor Supported
Intel® Core™ i3-7100U Processor
14nm, 2 cores, 4 threads, 2.4 GHz
TDP 15W
Memory Type
2 x DDR4 SO-DIMM sockets, Max. Capacity 32 GB
Support Dual Channel DDR4 2133 MHz memory modules
Integrated Network
1 x GbE LAN Port (Intel® I219V)
Integrated Video Controller
Integrated Graphics Processor - Intel® HD Graphics 620 support:
1 x HDMI 2.0 port (SDM), supporting a maximum resolution of 4096x2160 @60Hz
1 x DP port (Rear/SDM side), supporting a maximum resolution of 4096x2160 @60Hz
Integrated Audio Controller
Intel® Integrated Audio
Expansion Slot
1 x 2280 M.2 M-Key (PCIe x4, SATA 6Gb/s)
1 x 2230 M.2 E-key (WiFi/BT)
Rear I/O Connectors
1 x Display Port
1 x RJ45 LAN Port
4 x USB 3.2 Gen 1
1 x PWR LED
1 x HDD LED
2 x External Antenna Holes (Optional)
1 x Reset button
1 x Power button
OS Driver Supported
Windows 10 (x64)
Packaging Bundle
Carton size: 465 x 351 x 217 (mm)
Packing Capacity: 10pcs

Including:
Screw Kit with #0 ZIPLOCK BAG SCREW-BIND M3.0*L5.0 NI x 2pcs (P/N: 25KSD-130053-S0R)
Ordering Information
9MFLP3ALMR-SI (Box packing)
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
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