TO23-H60
(rev. 100)

ORv3 Compute Node - 3rd Gen Intel^® Xeon^® Scalable - 2OU 3-Node DP 4-Bay Gen4 NVMe/SATA/SAS

3rd Gen Intel^® Xeon^® Scalable Processors
Dual processor, LGA 4189
8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
1 x Dedicated management port
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
2 x LP PCIe Gen4 x16 slots
1 x OCP 3.0 Gen4 x16 slot
48V DC Bus Bar power solution

* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2OU 3-Node
180 x 90 x 740

Open Rack Version

ORv3

Motherboard

MH62-HD2

CPU

3rd Generation Intel^® Xeon^® Scalable Processors
Dual processor, 10nm technology
CPU TDP up to 270W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Memory

16 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz

LAN

Front side:
1 x 10/100/1000 Management LAN

Storage

Front side:
4 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

SAS

Depends on SAS add-in card

RAID

Intel^® SATA RAID 0/1/10/5

Expansion Slots

Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0

Riser Card CRSH01H:
- 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
NCSI function supported

Front I/O

2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x System status LED

Power Supply

Supports up to 1600W

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

System Fans

2 x 80x80x38mm (14,900rpm)

Packaging Dimensions

995 x 358 x 270 mm

Packaging Content

1 x TO23-H60
2 x CPU heatsinks

Part Numbers

- Barebone package: 6NTO23H60MR-00-1*
- Motherboard: 9MH62HD2NR-00
- CPU heatsink: 25ST1-35320C-C1R
- Front panel board - COFP212: 9COFP212NR-00
- Backplane board - COBP540: 9COBP540NR-00
- Fan module: 25ST2-883825-S0S
- Riser card - CRSH01E: 9CRSH01ENR-00
- Riser card - CRSH01H: 9CRSH01HNR-00

Optional parts:

- RMA packaging: 6NTO23H60SR-RMA-A100

No. of Bus Bars

1 x 48V Bus Bar

SUPPORT

下载

驱动程序
BIOS
工具程序
Firmware

使用手冊
支持列表

Online Support

驱动程序

BIOS

工具程序

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

芯片组

版本

档案大小

日期

Intel^® Chipset Driver

Version : 10.1.18807.8279

3.29 MB

Apr 25, 2022

TO23-H60 (rev. 100)

SPECIFICATIONS

SUPPORT

RESOURCES

TO23-H60 (rev. 100)

TO23-H60
(rev. 100)