TO25-S11-AA01

ORv3 Compute Node - 5th/4th Gen Intel® Xeon® Scalable - 2OU 2-Node UP 10-Bay E1.S Gen4 NVMe
  • Single 5th/4th Gen Intel® Xeon® Scalable Processors
  • Single Intel® Xeon® CPU Max Series
  • 8-Channel DDR5 RDIMM, 8 x DIMMs
  • Dual ROM Architecture
  • 10 x E1.S Gen4 NVMe hot-swap bays
  • 1 x M.2 slot with SATA interface
  • 2 x FHHL PCIe Gen5 x16 slots
  • 1 x LP PCIe Gen5 x8 slot
  • 48V DC Bus Bar power solution
Ordering Numbers: 6NTO25S11DR000AB01*
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2OU 2-Node
262.7 x 90 x 740
Open Rack Version
ORv3
Motherboard
MS13-HD0
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series

Single processor, TDP up to 350W
Memory
8 x DIMM slots
DDR5 memory supported
8-Channel memory per processor

5th Gen Intel® Xeon®:
RDIMM: Up to 5600 MT/s

4th Gen Intel® Xeon®:
RDIMM: Up to 4800 MT/s

Intel® Xeon® Max Series:
RDIMM: Up to 4800 MT/s
LAN
Front:
1 x 10/100/1000 Mbps Management LAN
Storage
Front hot-swap:
10 x 9.5mm E1.S Gen4 NVMe

Internal M.2 (CFPH010):
1 x M.2 (2242/2260/2280/22110), SATA, from PCH
SAS
N/A
RAID
N/A
PCIe Expansion Slots
Riser Card CRSH02D:
- 2 x FHHL x16 (Gen5 x16)

Riser Card CRSH02E:
- 1 x LP x16 (Gen5 x16), occupied for E1.S
- 1 x LP x16 (Gen5 x8)
Front I/O
1 x MLAN
1 x ID button with LED

I/O board - CFPH010:
1 x USB 3.2 Gen1 port (Type-C)
1 x Mini-DP
1 x Power button with LED
1 x System status LED
1 x ID LED
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
Supports up to 1600W
System Management
ASPEED® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022
Windows Server 2025
System Fans
N/A
Packaging Dimensions
1177 x 479 x 261 mm
Packaging Content
1 x TO25-S11-AA01
1 x CPU heatsink
3 x Carriers
Part Numbers
- Barebone package (5th/4th Gen): 6NTO25S11DR000AB01*
- Barebone package (4th Gen): 6NTO25S11DR000AA01*
- Motherboard: 9MS13HD0UR-000*
- CPU heatsink: 25ST1-143102-C1R
- Front panel board - COFP111: 9COFP111NR-00*
- Re-driver card - CORC211: 9CORC211NR-00*
- Riser card - CRSH02D: 9CRSH02DNR-00*
- Riser card - CRSH02E: 9CRSH02ENR-00*
- EDSFF base board - COBP721: 9COBP721NR-00*
- EDSFF base board - COBP740: 9COBP740NR-00*
- EDSFF riser card - CSPP010: 9CSPP010NR-00*
- I/O board with M.2 slot - CFPH010: 9CFPH010NR-00*

Optional parts:

- RMA packaging: 6NTO25S11SR-RMA-A100
No. of Bus Bars
1 x 48V Bus Bar
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Linux
BIOS
说明
版本
档案大小
日期

1. Updates RC 113.D55 (EagleStream uPLR3 BKC 2024 WW37).

2. Updates EMR Microcode:
EMR Production A*/R* Step:
m_87_c06f2_21000291.pdb

3. Updates SPR Microcode:
SPR Production E*/S* Step:
m_87_806f8_2b000620.pdb
SPR HBM Production B* Step:
m_10_806f8_2c0003e0.pdb

4. Includes security updates for
CVE-2024-21781, CVE-2024-21820,
CVE-2024-21829, CVE-2024-21850,
CVE-2024-21853, CVE-2024-21859,
CVE-2024-22185, CVE-2024-23599,
CVE-2024-23918, CVE-2024-23984,
CVE-2024-24968, CVE-2024-24985,
CVE-2024-25565, CVE-2024-25571,
CVE-2024-26021, CVE-2024-27457,
CVE-2024-28047, CVE-2024-30211,
CVE-2024-31068, CVE-2024-31155,
CVE-2024-31157, CVE-2024-33607,
CVE-2024-36242, CVE-2024-37020,
CVE-2024-39279.

Version : R11
29.8 MB
Jan 20, 2025
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手册
说明
版本
档案大小
日期
说明
版本
档案大小
日期
操作系统支持列表
Version : R12
0.22 MB
Jul 15, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series

RESOURCES

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