HPC/AI Server - Intel® Xeon® 6 Processors - 2U DP 8 x PCIe Gen5 GPUs
  • Supports up to 8 x Dual slot Gen5 GPUs
  • Dual Intel® Xeon® 6 Processors, LGA 4710
  • 8-Channel DDR5 RDIMM / MCR DIMM, 16 x DIMMs
  • Dual ROM Architecture
  • 2 x 10Gb/s LAN ports via Intel® X710-AT2
  • 8 x 2.5" SATA/SAS-4 hot-swappable bays
  • 8 x FHFL PCIe Gen5 x16 slots for GPUs
  • 2 x LP PCIe Gen5 x16 slots
  • Dual 3000W 80 PLUS Titanium redundant power supply
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。


Dimensions (WxHxD, mm)
448 x 87.5 x 850
Intel® Xeon® 6 Processors
- Intel® Xeon® 6700E-Series Processors
- Intel® Xeon® 6700P-Series Processors (available Q1'25)
- Intel® Xeon® 6500P-Series Processors (available Q1'25)

Dual processor, TDP up to 225W (TBD)

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
2 x LGA 4710
Socket E2
System on Chip
16 x DIMM slots
DDR5 memory supported
MCR DIMM supported*
8-Channel memory architecture
RDIMM: Up to 6400 MT/s
MCR DIMM: Up to 8000 MT/s

*MCR DIMMs are only supported with Intel® Xeon® 6 Processors with P-cores.
Rear side:
2 x 10Gb/s LAN ports (1 x Intel® X710-AT2)
Support NCSI function

1 x 10/100/1000 Mbps Management LAN
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Front side:
4 x 2.5" Gen5 NVMe/SATA/SAS-4* hot-swappable bays
4 x 2.5" SATA/SAS-4* hot-swappable bays
- (SATA from CPU_0)

*SAS card is required to support SAS drives.

Note: NVMe support requires additional NVMe cables and occupies PCIe slots. Please refer to optional parts for qualified NVMe cables.
Require SAS add-in cards
Require RAID add-in cards
Expansion Slots
Riser Card CRCG02C x 2:
- 2 x PCIe x16 (Gen5 x16) FHFL slots, from CPU_0, for GPUs
- 2 x PCIe x16 (Gen5 x16) FHFL slots, from CPU_1, for GPUs

Riser Card CRCG02D x 2:
- 2 x PCIe x16 (Gen5 x16) FHFL slots, from CPU_0, for GPUs
- 2 x PCIe x16 (Gen5 x16) FHFL slots, from CPU_1, for GPUs

Riser Card CRSG01F x 2:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1

1) Maximum GPU dimensions (LxWxH): 285 x 111.5 x 39.5mm.
2) The system is only validated with a uniform GPU model.
Internal I/O
1 x VROC connector
1 x TPM header
1 x PRoT connector (only enabled on RoT SKU)
Front I/O
1 x Power button with LED
1 x ID button with LED
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED
Rear I/O
2 x USB 3.2 Gen1
1 x VGA
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A

Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
2 x 80x80x38mm (18,300rpm)
6 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1133 x 724 x 261 mm
Packaging Content
1 x G294-S45-AAP1
2 x CPU heatsinks
4 x Carriers
1 x L-shape Rail kit
Part Numbers
- Barebone package: 6NG294S45DR000AAP1*
- Motherboard: 9MS44G21UR-000
- L-shape Rail kit: 25HB2-A86102-K0R
- CPU heatsink: TBD
- Backplane board - CBPG086: 9CBPG086NR-00
- Fan module 80x80x38mm: 25ST2-88382R-S1R
- Fan module 80x80x80mm: 25ST2-888023-S1R
- M.2 type SATA card - CRS2810: 9CRS2810NR-00
- M.2 expansion card - CMTP1A0: 9CMTP1A0NR-00
- Riser card - CRCG02C: 9CRCG02CNR-00
- Riser card - CRCG02D: 9CRCG02DNR-00
- Riser card - CRSG01F: 9CRSG01FNR-00
- Power supply: 25EP0-23000R-G1S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- NVMe cable (MCIO 8i to 2 x MCIO 4i): 25CF9-350705-A4R (TBD)
- NVMe cable (MCIO 4i to MCIO 4i): 25CF9-700050-A4R (TBD)
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。


  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
Version : 2.1.76
147.87 MB
May 22, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022


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