G363-SR0- LAX4

HPC/AI Server - 5th/4th Gen Intel^® Xeon^® Scalable - 3U DP HGX™ H200 4-GPU DLC

# 人工智能平台 # 人工智能训练服务器 # 人工智能推理服务器 # 高性能计算平台

Liquid-cooled NVIDIA HGX™ H200 4-GPU
CPU+GPU direct liquid cooling solution
4th-generation NVIDIA^® NVLink™ 900GB/s
Dual 5th/4th Gen Intel^® Xeon^® Scalable Processors
Dual Intel^® Xeon^® CPU Max Series
8-Channel DDR5 RDIMM, 16 x DIMMs
Dual ROM Architecture
2 x 10Gb/s LAN ports via Broadcom^® BCM57416
2 x 1Gb/s LAN ports via Intel^® I350-AM2
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
1 x M.2 slot with PCIe Gen4 x4 interface
6 x LP PCIe Gen5 x16 slots
2+1 3000W 80 PLUS Titanium redundant power supplies

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* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

3U
448 x 130 x 800

Motherboard

MS63-HD2

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series

Dual processor, TDP up to 385W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

16 x DIMM slots
DDR5 memory supported
8-Channel memory per processor

5th Gen Intel^® Xeon^®:
RDIMM: Up to 5600 MT/s

4th Gen Intel^® Xeon^®:
RDIMM: Up to 4800 MT/s

Intel^® Xeon^® Max Series:
RDIMM: Up to 4800 MT/s

LAN

Front (I/O board - CLBH160):
2 x 1Gb/s LAN (1 x Intel^® I350-AM2)
- Support NCSI function (by switch setting)

1 x 10/100/1000 Mbps Management LAN

Rear:
2 x 10Gb/s LAN (1 x Broadcom^® BCM57416)
- Support NCSI function (by switch setting)

Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN

^[Note]When both MLAN ports are connected with cables, the front MLAN port will be set as the default.

Video

Integrated in Aspeed^® AST2600
- 1 x Mini-DP

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4^[1]
- (NVMe from PEX89144)

Internal M.2 (CMTP192):
1 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Intel^® SATA RAID 0/1/10/5

Support optional RAID add-in cards

Modular GPU

Liquid-cooled NVIDIA HGX™ H200 with 4 x SXM GPUs

PCIe Expansion Slots

Front:
Riser Card CRSH01R:
- 1 x LP x16 (Gen5 x16), from CPU_0

PCIe Cable:
- 1 x LP x16 (Gen5 x16), from CPU_1

1 x OCP NIC 3.0, from CPU_0, disabled

Rear:
4 x LP x16 (Gen5 x16), from PEX89144, support RDMA
- (Equipped with full-height brackets)

Front I/O

1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED

I/O board - CLBH160:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
2 x RJ45 ports (Intel I350)
1 x MLAN port (default)

Rear I/O

2 x RJ45 ports (Broadcom BCM57416)

MLAN board - CDB66:
1 x MLAN port

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

2+1 3000W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022

System Fans

4 x 80x80x80mm (17,000rpm)

Operating Properties

Operating temperature: 10°C to 40°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

^[Note]To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.

Packaging Dimensions

1176 x 782 x 295 mm

Packaging Content

1 x G363-SR0-LAX4
1 x Mini-DP to D-Sub cable
6 x Carriers
1 x L-shape Rail kit

Part Numbers

- Barebone w/ NVIDIA module: 6NG363SR0DR000LBX4*
- Motherboard: 9MS63HD2UR-000*
- L-shape Rail kit: 25HB2-A86102-K0R
- CoolIT CPU cold plate loop: 25ST7-100006-C4R
- CoolIT GPU cold plate loop: 25ST7-3000Z5-C4R
- Front panel board - CFP1000: 9CFP1000NR-00*
- Backplane board - CBP2081: 9CBP2081NR-00*
- Fan module: 25ST2-888030-S1R
- Fan module: 25ST2-888031-S1R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- OCP card - CNVC171: 9CNVC171NR-00*
- Front I/O board (incl. I350-AM2) - CLBH160: 9CLBH160NR-00*
- PCIe switch board: - CPBG901 9CPBG901NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000A-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NG363SR0SR-RMA-L100

SUPPORT

下载

驱动程序
BIOS
工具程序
Firmware

使用手册
支持列表

Online Support

驱动程序

BIOS

工具程序

Firmware

All
All
Windows Server 2022
Windows Server 2019
Linux

芯片组

版本

档案大小

日期

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

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SPECIFICATIONS

SUPPORT

RESOURCES

G363-SR0-LAX4

G363-SR0- LAX4