G593-SD1- LAX3

HPC/AI Server - 5th/4th Gen Intel^® Xeon^® Scalable - 5U DP NVIDIA HGX™ H200 8-GPU DLC

# 人工智能平台 # 人工智能训练服务器 # 人工智能推理服务器 # 高性能计算平台

CPU+GPU Direct liquid cooling solution
Liquid cooled NVIDIA HGX™ H200 8-GPU
900GB/s GPU-to-GPU bandwidth with NVIDIA^® NVLink^® and NVSwitch™
Dual 5th/4th Gen Intel^® Xeon^® Scalable Processors
Dual Intel^® Xeon^® CPU Max Series
8-Channel DDR5 RDIMM, 32 x DIMMs
Dual ROM Architecture
Compatible with NVIDIA BlueField^®-3 DPUs/SuperNICs
2 x 10Gb/s LAN ports via Intel^® X710-AT2
8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
4 x FHHL PCIe Gen5 x16 slots
8 x LP PCIe Gen5 x16 slots
4+2 3000W 80 PLUS Titanium redundant power supplies

加入比较表

* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

5U
447 x 219.7 x 945

Motherboard

MSB3-G41

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series

Dual processor, TDP up to 350W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4677
Socket E

Chipset

Intel^® C741

Memory

32 x DIMM slots
DDR5 memory supported
8-Channel memory architecture

5th Gen Intel^® Xeon^®:
RDIMM: Up to 5600 MT/s (1DPC), 4400 MT/s (2DPC)^[1]

4th Gen Intel^® Xeon^®:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

Intel^® Xeon^® Max Series:
RDIMM: Up to 4800 MT/s (1DPC), 4400 MT/s (2DPC)

^[1]5600 MT/s support under 2DPC configuration requires verified memory and BIOS setup. Please refer to the QVL for more information.

LAN

Front:
2 x 10Gb/s LAN (1 x Intel^® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Rear:
1 x 10/100/1000 Mbps Management LAN

^[Note]When both MLAN ports are connected with cables, the front MLAN port will be set as the default.

Video

Integrated in Aspeed^® AST2600
- 1 x VGA port

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe/SATA/SAS-4^[1]
- (NVMe from PEX89104)

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Intel^® SATA RAID 0/1/10/5

Support optional RAID add-in cards

PCIe Expansion Slots

Liquid cooled NVIDIA HGX™ H200 with 8 x SXM GPUs

Extension Board CPBG044 x 2:
- 8 x LP x16 (Gen5 x16), from PEX89104

Riser Card CPBGD20 x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89048

Front I/O

2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default port)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED

Rear I/O

1 x MLAN port

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply

4+2 3000W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

Motherboard:
2 x 40x40x28mm (25,000rpm)
3 x 60x60x56mm (24,000rpm)

PCIe slots:
4 x 40x40x28mm (25,000rpm)
2 x 40x40x56mm (32,000rpm)

GPU tray:
4 x 80x80x80mm (17,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

^[Note]If the room's relative humidity exceeds 60%, the inlet water temperature must be set between 40°C and 45°C to avoid condensation and ensure the system continues to operate optimally.

Packaging Dimensions

1200 x 890 x 700 mm

Packaging Content

1 x G593-SD1-LAX3
1 x CoolIT CPU cold plate loop
6 x Carriers
1 x L-shape Rail kit

Part Numbers

- Barebone w/ NVIDIA module: 6NG593SD1DR000LBX3*
- Motherboard: 9MSB3G41NR-000*
- L-shape Rail kit: 25HB2-A96102-K0R
- CoolIT CPU cold plate loop: TBD
- CoolIT GPU cold plate loop: 25ST7-3000G5-C4R
- CoolIT Switch cold plate loop: 25ST7-3000Z6-C4R
- Backplane board - CBPG680: 9CBPG680NR-00*
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- Fan module 40x40x56mm: 25ST2-40562M-A0R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 80x80x80mm: 25ST2-808037-S1R
- Riser card - CPBGD20: 9CPBGD20NR-00*
- I/O board - CDB66: 9CDB66NR-00*
- PCIe extension board - CPBG044: 9CPBG044NR-00*
- PCIe switch board - CPBG903: 9CPBG903NR-00*
- G-SCM board - CDCG120: 9CDCG120UR-00*
- Power supply: 25EP0-23000J-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R

SUPPORT

下载

驱动程序
BIOS
工具程序
Firmware

使用手冊
支持列表

Online Support

驱动程序

BIOS

工具程序

Firmware

All
All
Windows Server 2022
Windows Server 2019
Linux

芯片组

版本

档案大小

日期

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

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SPECIFICATIONS

SUPPORT

RESOURCES

G593-SD1-LAX3

G593-SD1- LAX3