H233-Z80- AAW1

High Density Server - AMD EPYC™ 9005/9004 - 2U 2-Node DP 4 x PCIe Gen5 GPUs 3000W
  • Supports up to 4 x Dual slot Gen5 GPUs
  • 2U 2-node rear access server system
  • Dual AMD EPYC™ 9005/9004 Series Processors per node
  • 12-Channel DDR5 RDIMM, 24 x DIMMs per node
  • Dual ROM Architecture
  • 4 x 1Gb/s LAN ports via Intel® I350-AM2
  • 4 x 2.5" Gen4 NVMe hot-swap bays
  • 4 x FHFL PCIe Gen5 x16 slots for GPUs
  • 2 x LP PCIe Gen5 x16 slots
  • 2 x OCP NIC 3.0 PCIe Gen5 x16 slots
  • Dual 3000W 80 PLUS Titanium redundant power supply
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 2-Node - Rear access
440 x 87.5 x 877
Motherboard
MZ83-HD0
CPU
AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Dual processor per node, cTDP up to 240W

[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
4 x LGA 6096
Socket SP5
Chipset
System on Chip
Memory
48 x DIMM slots
DDR5 memory supported
12-Channel memory architecture

AMD EPYC™ 9005:
RDIMM: Up to 6000 MT/s

AMD EPYC™ 9004:
RDIMM: Up to 4800 MT/s
LAN
Rear:
4 x 1Gb/s LAN (2 x Intel® I350-AM2)
- Support NCSI function

2 x 10/100/1000 Mbps Management LAN

[Note] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600 x 2
- 2 x Mini-DP
Storage
Front hot-swap:
4 x 2.5" Gen4 NVMe
- (NVMe from CPU_1)
SAS
N/A
RAID
N/A
PCIe Expansion Slots
PCIe Cable x 4:
- 4 x FHFL x16 (Gen5 x16), from CPU_0, for GPUs

Riser Card CRSH01R x 2:
- 2 x LP x16 (Gen5 x16), from CPU_0

2 x OCP NIC 3.0 (Gen5 x16), from CPU_0
- Support NCSI function
Front I/O
4 x Power buttons with LED (2 x buttons disabled)
4 x ID buttons with LED (2 x buttons disabled)
4 x Reset buttons (2 x buttons disabled)
4 x System status LEDs (2 x LEDs disabled)
1 x CMC status LED
1 x CMC reset button

[Note] Node 1 and Node 3 are disabled.
Rear I/O
4 x USB 3.2 Gen1 ports (Type-A)
2 x Mini-DP
4 x RJ45 ports
2 x MLAN ports
2 x System status LEDs
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply [1]

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

[1] The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 43.31 kg
Gross Weight: 45.46 kg
Packaging Dimensions
1179 x 700 x 380 mm
Packaging Content
1 x H233-Z80-AAW1
4 x CPU heatsinks
1 x Mini-DP to D-Sub cable
4 x GPU power cables (CPU 8pin, 400mm)
1 x 3-Section Rail Kit
Part Numbers
- Barebone package: 6NH233Z80DR000ACW1*
- Motherboard: 9MZ83HD0UR-000-3*
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-25320N-M1R/25ST1-25320Q-M1R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH081: 9CBPH081NR-00*
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01R: 9CRSH01RNR-00*
- I/O board (incl. LAN chip) - CLBH160: 9CLBH160NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (CPU 8pin, 400mm): 25CRI-4001D0-B1R
- Power supply: 25EP0-230009-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH233Z80SR-RMA-A100
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Linux
芯片组
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.78
147.79 MB
Dec 12, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手册
说明
版本
档案大小
日期

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