H252-Z10

HCI Server - AMD EPYC™ 7002 - 2U 4-Node UP 24-Bay NVMe/SATA/SAS
  • 2U 4-node rear access server system
  • AMD EPYC™ 7002 Series processors
  • Single processor per node, 7nm technology
  • 8-Channel RDIMM/LRDIMM DDR4, 32 x DIMMs
  • 8 x 1Gb/s LAN ports (Intel® I350-AM2)
  • 4 x Dedicated management ports
  • 1 x CMC port
  • 24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
  • 8 x M.2 slots with PCIe Gen3 x4 interface
  • 4 x LP PCIe Gen4 x16 slots
  • 4 x LP PCIe Gen3 x16 slots
  • 4 x OCP 2.0 Gen3 x16 mezzanine slots
  • Aspeed® AST2500 remote management controller
  • Dual 2000W 80 PLUS Platinum redundant power supply
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 695
Motherboard
MZ12-HD0
CPU
AMD EPYC™ 7002 Series processors
Single processor per node, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 225W, cTDP up to 240W

Supports cTDP 280W at ambient 30°C
M.2 devices not supported if using 280W CPU

Compatible with AMD EPYC™ 7001 Series processors
Socket
Per Node:
1 x LGA 4094

Total:
4 x LGA 4094

Socket SP3
Chipset
System on Chip
Memory
Per node:
8 x DIMM slots

Total:
32 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
Memory speed: Up to 3200 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
NCSI function supported

1 x Dedicated management port

Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
NCSI function supported

4 x Dedicated management ports
1 x CMC port
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
6 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays

Total:
24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
SAS
Depends on SAS add-on card
RAID
N/A
Expansion Slots
Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot
1 x PCIe x16 (Gen3 x16) low-profile slot

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)

2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

Total:
4 x PCIe x16 (Gen4 x16) low-profile slots
4 x PCIe x16 (Gen3 x16) low-profile slots

4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)

8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Internal I/O
Per node:
2 x M.2 slots
1 x USB 3.0 header
1 x TPM header
1 x OCP 2.0 mezzanine slots
1 x Front panel header
1 x Backplane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
*1 x CMC status LED

*Only one CMC status LED per system
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
Dual 2000W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 12A, 47-63Hz
- 200-219V~/ 10A, 47-63Hz
- 220-240V~/ 10A, 47-63Hz

DC Input:
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-127V~
+ 12V/ 83A
+ 12Vsb/ 3A
- Max 1800W/ 200-219V~
+ 12V/ 148A
+ 12Vsb/ 3A
- Max 1968W/ 200-240V~
+ 12V/ 162A
+ 12Vsb/ 3A
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019

Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP4 (x64) or later
SUSE Linux Enterprise Server 15 SP1 (x64) or later

Ubuntu 16.04.6 LTS (x64) or later
Ubuntu 18.04.3 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.1.0 or later
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 25.2 kg
Gross Weight: 43.6 kg
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H252-Z10
4 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH252Z10MR-00-1*
- Motherboard: 9MZ12HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-220008-D0S

Optional parts:

- Power cord 125V/15A (JP): 25CPA-018304-Q0R
- M.2 expansion card - CMTP051: 9CMTP051NR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH252Z10SR-RMA-A100
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • All
  • All
  • Windows Server 2019
  • Windows Server 2016 64bit
芯片组
芯片组
版本
档案大小
日期
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.76
147.87 MB
May 22, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手冊
说明
版本
档案大小
日期

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