H261-N80
(rev. 100/A00/B00)

High Density Server - 1st/2nd Gen Intel^® Xeon^® Scalable - 2U 4-Node DP 24-Bay Gen3 NVMe/SATA/SAS

2U 4-node with rear access server system
1st/2nd Gen Intel^® Xeon^® Scalable Processors
Dual processor per node, LGA 3647
Intel^® C621 Chipset
6-Channel RDIMM/LRDIMM DDR4, 64 x DIMMs
Supports Intel^® Optane™ DC Persistent Memory
8 x 10Gb/s BASE-T LAN ports via Intel^® X550-AT2
4 x Dedicated management ports
1 x CMC port
8 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
16 x 2.5" SATA/SAS hot-swappable bays
4 x LP PCIe Gen3 x16 slots
4 x LP PCIe Gen3 x8 slots
4 x OCP Gen3 x16 mezzanine slots
Aspeed^® AST2500 remote management controller
Dual 2200W 80 PLUS Platinum redundant power supply
Optimized performance with Mellanox Infiniband EDR 100G or Ethernet 100G products

加入比较表

* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87 x 820

Motherboard

MH61-HD3

CPU

2nd Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® Scalable Processors
Dual processor per node, TDP up to 165W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

Per Node:
2 x LGA 3647

Total:
8 x LGA 3647

Socket P

Chipset

Intel^® C621 Chipset

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel^® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel^® Xeon^® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)

DCPMM installation locations:
DIMM_P1_(G1, J1)

Note:
1. 2933MT/s for 2nd Generation Intel^® Xeon^® Scalable Processors only.
2. Intel^® Optane™ DC Persistent Memory for 2nd Generation Intel^® Xeon^® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.

LAN

Per node:
2 x 10Gb/s BASE-T LAN ports (Intel^® X550-AT2)
NCSI function supported

1 x Dedicated management port

Total:
8 x 10Gb/s BASE-T LAN ports (Intel^® X550-AT2)
NCSI function supported

4 x Dedicated management ports
1 x 10/100/1000 Mbps CMC port

*Omni-Path is supported in option.

Video

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip in CMC board:
Integrated in Aspeed^® AST1250 (For system BOM version 100 and A00)
Integrated in Aspeed^® AST2520 (For system BOM version B00)

Storage

Per node:
2 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
4 x 2.5" SATA/SAS hot-swappable bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)

Total:
8 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
16 x 2.5" SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

RAID

For SATA drives:
Intel^® SATA RAID 0/1/5/10

For U.2 drives:
Intel^® Virtual RAID On CPU (VROC) RAID 0/1

Note:
1) VROC module is compatible for Intel^® SSD only.
2) Default 1 PCS VROC module for one 2U 4-Node server system.

Expansion Slots

Per node:
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x PCIe x8 (Gen3 x8) low-profile slot
1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth

Total:
4 x PCIe x16 (Gen3 x16) low-profile slots
4 x PCIe x8 (Gen3 x8) low-profile slots
4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth

Internal I/O

Per node:
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
*1 x CMC status LED

*Only one CMC status LED per system.

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system.

Backplane Board

Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000

Power Supply

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A

Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.

System Management

Aspeed^® AST2500 management controller
Avocent^® MergePoint IPMI 2.0 web interface:

Network settings
Network security settings
Hardware information
Users control
Services settings
IPMI settings
Sessions control
LDAP settings
Power control
Fan profiles
Voltages, fans and temperatures monitoring
System event log
Events management (platform events, trap settings, email settings)
Serial Over LAN
vKVM & vMedia (HTML5)

OS Compatibility

For Skylake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later

System Fans

8 x 80x80x38mm (16,300rpm)
Supports N+1 Redundancy (for CPU TDP under 125W only)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

35 kg (full packaging)

Packaging Dimensions

1167 x 700 x 309 mm

Packaging Content

1 x H261-N80
8 x CPU heatsinks
1 x Rail kit
1 x VROC module
8 x Non-Fabric CPU carriers

Part Numbers

- Barebone package: 6NH261N80MR-00*
- Motherboard: 9MH61HD3NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-253203-F2R/25ST1-253204-F2R
- Backplane board - CBPH0O0: 9CBPH0O0NR-NJ
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222001-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 extension card: 9CMTP01LNR-00
- Ring topology kit: 6NH23NR48SR-00

SUPPORT

下载

驱动程序
BIOS
工具程序
Firmware

使用手冊
支持列表

Online Support

驱动程序

BIOS

工具程序

Firmware

QVL

All
All
Windows Server 2019
Windows Server 2016 64bit
Windows Server 2012 R2 64bit
Linux

芯片组

版本

档案大小

日期

Intel^® Chipset Driver

Version : 10.1.17861.8101

3.34 MB

Apr 18, 2019

H261-N80 (rev. 100/A00/B00)

SPECIFICATIONS

SUPPORT

RESOURCES

H261-N80 (rev. 100/A00/B00)

H261-N80
(rev. 100/A00/B00)