H263-S63- LAW1

High Density Server - 5th/4th Gen Intel® Xeon® Scalable - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS 3000W DLC
  • Direct liquid cooling solution
  • 2U 4-node rear access server system
  • Dual 5th/4th Gen Intel® Xeon® Scalable Processors per node
  • Dual Intel® Xeon® CPU Max Series per node
  • 8-Channel DDR5 RDIMM, 64 x DIMMs
  • Dual ROM Architecture
  • 1 x CMC port
  • 8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
  • 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
  • 4 x LP PCIe Gen5 x16 slots
  • 4 x OCP 3.0 Gen5 x16 slots
  • Dual 3000W 80 PLUS Titanium redundant power supply
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
Motherboard
MS63-HD1
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor per node, TDP up to 385W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
Per Node:
2 x LGA 4677

Total:
8 x LGA 4677

Socket E
Chipset
Intel® C741
Memory
Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported

5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s
Intel® Xeon® Max Series: Up to 4800 MT/s
LAN
Per node:
1 x 10/100/1000 Mbps Management LAN

Total:
4 x 10/100/1000 Mbps Management LAN
*1 x CMC port

*Please refer to optional parts for ring topology support.

Note: Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1

Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1

SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
Intel® SATA RAID 0/1
Expansion Slots
Per node:
Riser Card CRSH01U:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function

Optional 1 x M.2 slot (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards

Total:
Riser Card CRSH01U x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0

4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function

Optional 4 x M.2 slots (CMTP061):
- M-key
- PCIe Gen4 x4, from CPU_1
- Support 2280/22110 cards
Internal I/O
Per node:
1 x TPM header
1 x VROC connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system.
Rear I/O
Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED

Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port

*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply
Available for 2+1 redundant power supply configuration (optional)

AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A

Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022 (x64)
System Fans
4 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Weight
Net Weight: 47.28 kg
Gross Weight: 51.83 kg
Packaging Dimensions
w/ cold plate loops: 1185 x 705 x 409 mm
w/o cold plate loops: 1176 x 709 x 322 mm
Packaging Content
1 x H263-S63-LAW1
4 x CoolIT CPU cold plate loops
24 x Carriers
1 x 3-Section Rail kit
Part Numbers
- Barebone w/ cold plates (5th/4th Gen): 6NH263S63DR000LBW1*
- Barebone w/ cold plates (4th Gen): 6NH263S63DR000LAW1*
- Barebone w/o cold plates (5th/4th Gen): 6NH263S63DZ000LBW1*
- Barebone w/o cold plates (4th Gen): 6NH263S63DZ000LAW1*
- Motherboard: 9MS63HD1UR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- CoolIT CPU cold plate loop: 25ST7-100006-C4R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH081: 9CBPH081NR-00
- Fan module: 25ST2-88382P-S1R
- Riser card - CRSH01U: 9CRSH01UNR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Power supply: 25EP0-23000L-L0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00
- Ring topology kit (10-kit package): 6NH263S62S1000AAN11
- GIGABYTE cold plate loop: 25H26-3S62000-E01X (QPA:4)
- GIGABYTE 2U4N Manifold: 25H27-3Z80000-E07X (1 set per rack)
- Leak sensor board: 6NH263S62S1000LAN11 (QPA:4)
- RMA packaging: 6NH263S63SR-RMA-L100
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Linux
RAID
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.76
147.87 MB
May 22, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手冊
说明
版本
档案大小
日期
说明
版本
档案大小
日期
操作系统支持列表
Version : 1.5
0.22 MB
Jan 04, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series

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