E164-S30-AAG1

Edge Server - Intel® Xeon® 6 Processors - 1U UP 2-Bay Gen5 NVMe/SATA/SAS-4
  • Single Intel® Xeon® 6 Processors, LGA 4710
  • 8-Channel DDR5 RDIMM / MCR DIMM, 16 x DIMMs
  • Dual ROM Architecture
  • 1 x 1Gb/s LAN port via Intel® I210-AT
  • 2 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
  • 1 x M.2 slot with PCIe Gen5 x2 interface
  • 1 x M.2 slot with PCIe Gen5 x2 interface, shared with SATA
  • 2 x FHHL PCIe Gen5 x16 slots
  • 2 x OCP NIC 3.0 PCIe Gen5 x16 slots
  • Dual 800W 80 PLUS Titanium redundant power supply
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
1U
438 x 43.5 x 520
Motherboard
MS34-DC0
CPU
Intel® Xeon® 6 Processors
- Intel® Xeon® 6700E-Series Processors
- Intel® Xeon® 6700P-Series Processors (available Q1'25)
- Intel® Xeon® 6500P-Series Processors (available Q1'25)

Single processor, TDP up to 350W
Socket
1 x LGA 4710
Socket E2
Chipset
System on Chip
Memory
16 x DIMM slots
DDR5 memory supported
8-Channel memory architecture
MCR DIMM supported [1]
RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
MCR DIMM: Up to 8000 MT/s

[1] MCR DIMMs are only supported with Intel® Xeon® 6 Processors with P-cores and in a 1DPC configuration.
LAN
Rear:
1 x 1Gb/s LAN (1 x Intel® I210-AT)
- Supports NCSI function

1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
- 1 x Mini-DP
Storage
Front hot-swap:
2 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x2
1 x M.2 (2280/22110), PCIe Gen5 x2, shared with SATA [2]

[1] SAS card is required to support SAS drives.
[2] To enable the M.2 slot, please adjust the switch according to the manual for proper support.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
Onboard VROC key header
PCIe Expansion Slots
Riser Card CRS101O:
- 1 x FHHL x16 (Gen5 x16)

Riser Card CRS101P:
- 1 x FHHL x16 (Gen5 x16)

2 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function
Front I/O
1 x USB 3.2 Gen1 port (Type-A)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs (1 x LED disabled)
1 x Storage activity LED
1 x System status LED
Rear I/O
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
1 x RJ45 port
1 x MLAN port
1 x ID button with LED
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012

1 x PRoT connector (only enabled on RoT SKU)
Power Supply
Dual 800W 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V ~/ 10A, 50-60Hz
- 200-240V~/ 5A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 5A

DC Output:
- Max 800W
+12.2V/ 65A
+12.2Vsb/ 3A

[Note] GIGABYTE provides PSUs with various energy efficiency ratings and power outputs. Please contact our sales representatives to determine the best configuration for your system.
System Management
Aspeed® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
5 x 40x40x56mm (32,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
782 x 588 x 212 mm
Packaging Content
1 x E164-S30-AAG1
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
2 x Carriers

[Note] Rail kit not included. Please refer to optional parts for compatible rail kit.
Part Numbers
- Barebone package: 6NE164S30DR000AAG1*
- Motherboard: 9MS34DC0UR-000*
- CPU heatsink: 25ST1-4Z3200-S7R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP1000: 9CFP1000NR-00*
- Backplane board - CBP2025: 9CBP2025NR-00*
- Fan module: 25ST2-40562H-A0R
- Riser card - CRS101O: 9CRS101ONR-00*
- Riser card - CRS101P: 9CRS101PNR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-20800A-G1S

Optional parts:

- 2-Section Rail kit (385-480mm): 25HB2-3A0204-K0R (MOQ: 500)
- 2-Section Rail kit (660-840mm): 25HB2-3A0203-K0R
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Linux
RAID
公用程式
公用程式
版本
档案大小
日期
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
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