E263-Z30
(rev. AAD1)

Other SKU

Edge Server - AMD EPYC™ 9004 - 2U UP 2 x PCIe Gen5 GPUs

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Supports up to 2 x Dual slot Gen5 GPUs
AMD EPYC™ 9004 Series processors
AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
12-Channel RDIMM DDR5, 12 x DIMMs
Dual ROM Architecture
1 x 1Gb/s LAN port (Intel^® I210-AT)
1 x Dedicated management port
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays on the rear side
1 x M.2 slot with PCIe Gen3 x4 interface
2 x FHFL PCIe Gen5 x16 slots for GPUs
2 x OCP 3.0 Gen5 x16 slots
1+1 1600W 80 PLUS Platinum redundant power supplies

加入比较表

* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U
438 x 87.5 x 520

Motherboard

MZ33-DC0

CPU

AMD EPYC™ 9004 Series processors
AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
*Up to 128 cores, 256 threads per processor
cTDP up to 300W at ambient 35°C

*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.

Socket

1 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

12 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz

LAN

Rear side:
1 x 1Gb/s LAN port (1 x Intel^® I210-AT)
Supports NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Storage

Rear side:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

SAS

Depends on SAS add-in card

RAID

N/A

Expansion Slots

Riser Card CRS201M:
- 1 x PCIe x16 (Gen5 x16) FHFL slot, for GPUs

Riser Card CRS201H:
- 1 x PCIe x16 (Gen5 x16) FHFL slot, for GPUs

2 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth
Support NCSI function

1 x M.2 slot:
- M-key
- PCIe Gen3 x4
- Supports 2280/22110 cards

*Please refer to optional parts for H100/A100/MI210 power cables.
1x 350/360mm + 1x 480/490mm configuration is recommended.

Internal I/O

1 x TPM header

Front I/O

2 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x LAN activity LED
1 x Storage activity LED
1 x System status LED

Rear I/O

2 x USB 3.2 Gen1
1 x Mini-DP
1 x RJ45
1 x MLAN
1 x ID button with LED

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

1+1 1600W 80 PLUS Platinum redundant power supplies

AC Input:
- 100-120V~/ 12A, 50/60Hz
- 200-240V~/ 10A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-120V~
+ 12V/ 81.5A
+ 12Vsb/ 2.5A
- Max 1600W/ 200-240V~ or 240Vdc Input
+ 12V/ 133A
+ 12Vsb/ 2.5A

Note: The default power supply is based on a basic system configuration. Please contact with technical representatives to determine the best power supply selection for your system configuration requirements and preferred efficiency.

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 16 kg
Gross Weight: 19 kg

Packaging Dimensions

732 x 588 x 285 mm

Packaging Content

1 x E263-Z30
1 x CPU heatsink
1 x Mini-DP to D-Sub cable

*Rail kit not included. Please refer to optional parts for compatible rail kit.

Part Numbers

- Barebone package: 6NE263Z30DR000AAD1*
- Motherboard: 9MZ33DC0UR-000
- CPU heatsink: 25ST1-553201-M1R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP2001: 9CFP2001NR-00
- Backplane board - CBP2022: 9CBP2022NR-00
- Fan module: 25ST2-88382T-S1R
- Riser card - CRS201H: 9CRS201HNR-00
- Riser card - CRS201M: 9CRS201MNR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (2x 6+2pin PCIe, 350mm): 25CRI-350305-Y4R
- GPU power cable (2x 6+2pin PCIe, 480mm): 25CRI-480300-Y4R
- Power supply: 25EP0-216008-L0S

Optional parts:

- 2-Section Rail kit: 25HB2-3A0204-K0R
- A100/MI210 power cable (8pin CPU, 350mm): 25CRI-350100-Y4R
- A100/MI210 power cable (8pin CPU, 480mm): 25CRI-480101-Y4R
- H100 power cable (12VHPWR, 360mm): 25CRI-360102-Y4R
- H100 power cable (12VHPWR, 490mm): 25CRI-490102-Y4R

SUPPORT

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驱动程序
BIOS
工具程序
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支持列表

Online Support

驱动程序

BIOS

工具程序

Firmware

QVL

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Windows Server 2022
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芯片组

版本

档案大小

日期

AMD Chipset Driver

Version : 4.06.27.500

16.58 MB

Nov 11, 2022

E263-Z30 (rev. AAD1)

SPECIFICATIONS

SUPPORT

RESOURCES

E263-Z30 (rev. AAD1)

E263-Z30
(rev. AAD1)