R133-C11- AAG1
Rack Server - AMD EPYC™ 4004 / Ryzen™ 9000 / Ryzen™ 7000 - 1U UP 1 x PCIe Gen5 GPU Titanium
- Supports 1 x Dual slot Gen5 GPU
- Single AMD EPYC™ 4004 / Ryzen™ 9000 / Ryzen™ 7000 Series Processors
- Dual Channel DDR5 ECC/Non-ECC UDIMM, 4 x DIMMs
- 2 x 10Gb/s LAN ports via Broadcom® BCM57416
- 2 x 1Gb/s LAN ports via Broadcom® BCM5720
- 4 x 3.5"/2.5" SATA hot-swap bays
- 4 x 2.5" 7mm SATA hot-swap bays
- 1 x M.2 slot with PCIe Gen4 x4 interface
- 1 x FHFL PCIe Gen5 x16 slot for GPUs
- 1 x FHHL PCIe Gen4 x4 slot
- 1+1 800W 80 PLUS Titanium redundant power supplies
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
1U
438 x 43.5 x 710
438 x 43.5 x 710
Motherboard
MC13-BL0
CPU
AMD EPYC™ 4004 Series Processors
AMD Ryzen™ 9000 Series Processors
AMD Ryzen™ 7000 Series Processors
Single processor, TDP up to 170W
[Note] Overclocking is not supported due to thermal limitations.
AMD Ryzen™ 9000 Series Processors
AMD Ryzen™ 7000 Series Processors
Single processor, TDP up to 170W
[Note] Overclocking is not supported due to thermal limitations.
Socket
1 x AM5
Chipset
AMD B650E
Memory
4 x DIMM slots
DDR5 memory supported
Dual Channel memory architecture
AMD Ryzen™ 9000:
UDIMM: Up to 5600 MT/s (1DPC), 3600 MT/s (2DPC)
AMD EPYC™ 4004 / Ryzen™ 7000:
UDIMM: Up to 5200 MT/s (1DPC), 3600 MT/s (2DPC)
DDR5 memory supported
Dual Channel memory architecture
AMD Ryzen™ 9000:
UDIMM: Up to 5600 MT/s (1DPC), 3600 MT/s (2DPC)
AMD EPYC™ 4004 / Ryzen™ 7000:
UDIMM: Up to 5200 MT/s (1DPC), 3600 MT/s (2DPC)
LAN
Rear:
2 x 10Gb/s LAN (1 x Broadcom® BCM57416)
2 x 1Gb/s LAN (1 x Broadcom® BCM5720)
- Support NCSI function (by switch)
1 x 10/100/1000 Mbps Management LAN
2 x 10Gb/s LAN (1 x Broadcom® BCM57416)
2 x 1Gb/s LAN (1 x Broadcom® BCM5720)
- Support NCSI function (by switch)
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
- 1 x Mini-DP
- 1 x Mini-DP
Storage
Front hot-swap:
4 x 3.5"/2.5" SATA [1]
4 x 2.5" 7mm SATA [1]
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen4 x4, from FCH
[1] SATA supported only.
4 x 3.5"/2.5" SATA [1]
4 x 2.5" 7mm SATA [1]
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen4 x4, from FCH
[1] SATA supported only.
SAS
N/A
RAID
RAID 0/1/10
PCIe Expansion Slots
PCIe Cable:
- 1 x FHFL x16 (Gen5 x16), from CPU, for GPUs [1]
Riser Card CRSE016:
- 1 x FHHL x4 (Gen4 x4), from CPU
[1] Supports GPUs up to 300W.
- 1 x FHFL x16 (Gen5 x16), from CPU, for GPUs [1]
Riser Card CRSE016:
- 1 x FHHL x4 (Gen4 x4), from CPU
[1] Supports GPUs up to 300W.
Front I/O
1 x USB 3.2 Gen1 port (Type-A)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x Storage activity LED
1 x System status LED
Rear I/O
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
4 x RJ45 ports
1 x MLAN port
1 x ID button with LED
1 x Mini-DP
4 x RJ45 ports
1 x MLAN port
1 x ID button with LED
Backplane Board
Speed and bandwidth:
SATA 6Gb/s
SATA 6Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
1+1 800W 80 PLUS Titanium redundant power supplies
AC Input:
- 100-127V~/ 10A, 50-60Hz
- 200-240V~/ 5A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 5A
DC Output:
- Max 800W
+12.2V/ 65A
+12.2Vsb/ 3A
AC Input:
- 100-127V~/ 10A, 50-60Hz
- 200-240V~/ 5A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 5A
DC Output:
- Max 800W
+12.2V/ 65A
+12.2Vsb/ 3A
System Management
Aspeed® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
EPYC 4004 Series:
Ubuntu 22.04
Ubuntu 24.04
Windows Server 2022
Ryzen 9000/7000 Series:
Windows 10 21H2
Windows 11
Ubuntu 22.04
Ubuntu 24.04
Windows Server 2022
Ryzen 9000/7000 Series:
Windows 10 21H2
Windows 11
System Fans
2 x 40x40x56mm (29,700rpm)
3 x 40x40x56mm (32,000rpm)
3 x 40x40x56mm (32,000rpm)
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 16.8 kg
Gross Weight: 18.8 kg
Gross Weight: 18.8 kg
Packaging Dimensions
977 x 588 x 236 mm
Packaging Content
1 x R133-C11-AAG1
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
1 x GPU power cable (2x PCIe 8pin, 700mm)
1 x 2-Section Rail kit
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
1 x GPU power cable (2x PCIe 8pin, 700mm)
1 x 2-Section Rail kit
Part Numbers
- Barebone package (EPYC/Ryzen 9000): 6NR133C11MR000ACG1*
- Barebone package (EPYC/Ryzen 7000): 6NR133C11MR000ABG1*
- Barebone package (Ryzen 7000): 6NR133C11MR000AAG1*
- Motherboard: 9MC13BL0NR-000*
- 2-Section Rail kit (CMA not supported): 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-443300-S7R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP1010: 9CFP1010NR-00*
- Backplane board - CBP1045: 9CBP1045NR-00*
- Backplane board - CBP1047: 9CBP1047NR-00*
- Fan module: 25ST2-405623-A0R/25ST2-40562H-A0R
- Riser card - CRSE016: 9CRSE01016NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (2x PCIe 8pin, 700mm): 25CRI-700004-G5R
- Power supply: 25EP0-20800C-G1S
Optional parts:
- 3-Section Rail kit (Supports CMA): 25HB2-A56120-K0R
- Cable Management Arm: 25HBZ-R18100-K0R
- Barebone package (EPYC/Ryzen 7000): 6NR133C11MR000ABG1*
- Barebone package (Ryzen 7000): 6NR133C11MR000AAG1*
- Motherboard: 9MC13BL0NR-000*
- 2-Section Rail kit (CMA not supported): 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-443300-S7R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP1010: 9CFP1010NR-00*
- Backplane board - CBP1045: 9CBP1045NR-00*
- Backplane board - CBP1047: 9CBP1047NR-00*
- Fan module: 25ST2-405623-A0R/25ST2-40562H-A0R
- Riser card - CRSE016: 9CRSE01016NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (2x PCIe 8pin, 700mm): 25CRI-700004-G5R
- Power supply: 25EP0-20800C-G1S
Optional parts:
- 3-Section Rail kit (Supports CMA): 25HB2-A56120-K0R
- Cable Management Arm: 25HBZ-R18100-K0R
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SUPPORT
驱动程序
BIOS
工具程序
Firmware
- All
- All
- Windows Server 2022
- Windows 11 64bit
- Windows 10 64bit
芯片组
网卡
SATA RAID/AHCI
BIOS
说明
版本
档案大小
日期
Updates to AGESA 1.2.0.1 to support AMD Ryzen 9000 Series processors.
Version : R04
22.86 MB
Dec 02, 2024
Update AGESA-V9 ComboAm5 1.1.0.2b to support AMD EPYC 4004 Processors.
Version : R01
19.45 MB
May 21, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
注意:
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
使用手册
说明
版本
档案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
11.72 MB
Aug 12, 2024
英语
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