R263-Z32 (rev. AAC1)
(rev.AAD1)
AMD EPYC™ 9004 Server System - 2U UP 24-Bay NVMe/SATA/SAS
| Application:
网络服务器
Application:
- AMD EPYC™ 9004 series processor family
- Single processor, 5nm technology
- 12-Channel RDIMM DDR5, 12 x DIMMs
- Dual ROM Architecture supported
- 1 x 1Gb/s LAN port (Intel® I210-AT)
- 1 x Dedicated management port
- 8 x 2.5" Gen4 NVMe hot-swappable bays
- 16 x 2.5" SATA hot-swappable bays
- 1 x M.2 slot with PCIe Gen3 x4 interface
- 2 x FHHL PCIe Gen5 x16 slots
- 2 x FHHL PCIe Gen4 x8 slots
- 2 x OCP 3.0 Gen5 x16 mezzanine slots
- Dual 1300W (240V) 80 PLUS Platinum redundant power supply
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U
438 x 87.5 x 700
438 x 87.5 x 700
Motherboard
MZ33-DC0
CPU
AMD EPYC™ 9004 series processor family
Single processor, 5nm technology
Up to 96-core, 192 threads per processor
cTDP up to 360W
Supports CPU 400W at ambient 30°C
*9x74F CPUs supported up to 360W TDP. cTDP 400W can only be supported under specific conditions. Please contact our customer support for details.
Single processor, 5nm technology
Up to 96-core, 192 threads per processor
cTDP up to 360W
Supports CPU 400W at ambient 30°C
*9x74F CPUs supported up to 360W TDP. cTDP 400W can only be supported under specific conditions. Please contact our customer support for details.
Socket
1 x LGA 6096
Socket SP5
Socket SP5
Chipset
System on Chip
Memory
12 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 128GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 128GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
LAN
Rear side:
1 x 1Gb/s LAN port (1 x Intel® I210-AT)
Supports NCSI function
1 x 10/100/1000 management LAN
1 x 1Gb/s LAN port (1 x Intel® I210-AT)
Supports NCSI function
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
Front side:
8 x 2.5" Gen4 NVMe hot-swappable bays
16 x 2.5" SATA/SAS hot-swappable bays
SAS card is required for SAS devices support
8 x 2.5" Gen4 NVMe hot-swappable bays
16 x 2.5" SATA/SAS hot-swappable bays
SAS card is required for SAS devices support
SAS
Depends on SAS Add-on card
RAID
N/A
Expansion Slots
Riser Card CRS201M:
- 1 x PCIe x16 (Gen5 x16) FHHL slot
- 1 x PCIe x16 (Gen4 x8) FHHL slot
Riser Card CRS201H:
- 1 x PCIe x16 (Gen5 x16) FHHL slot
- 1 x PCIe x16 (Gen4 x8) FHHL slot
2 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth
Support NCSI function
1 x M.2 slot:
- M-key
- PCIe Gen3 x4
- Supports 2280/22110 cards
- 1 x PCIe x16 (Gen5 x16) FHHL slot
- 1 x PCIe x16 (Gen4 x8) FHHL slot
Riser Card CRS201H:
- 1 x PCIe x16 (Gen5 x16) FHHL slot
- 1 x PCIe x16 (Gen4 x8) FHHL slot
2 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth
Support NCSI function
1 x M.2 slot:
- M-key
- PCIe Gen3 x4
- Supports 2280/22110 cards
Internal I/O
1 x M.2 slot
1 x TPM header
2 x OCP 3.0 mezzanine slots
1 x TPM header
2 x OCP 3.0 mezzanine slots
Front I/O
2 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x LAN activity LED
1 x HDD activity LED
1 x System status LED
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x LAN activity LED
1 x HDD activity LED
1 x System status LED
Rear I/O
2 x USB 3.2 Gen1
1 x Mini-DP
1 x RJ45
1 x MLAN
1 x ID button with LED
1 x Mini-DP
1 x RJ45
1 x MLAN
1 x ID button with LED
Backplane I/O
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
Dual 1300W (240V) 80 PLUS Platinum redundant power supply
AC Input:
- 100-240V~/ 12-7A, 50-60Hz
- 200-240V~/ 8A, 50-60Hz
DC Input:
- 240Vdc/ 6.5A
DC Output:
- Max 1000W/ 100-240V~
+ 12V/ 80.5A
+ 12Vsb/ 3A
- Max 1300W/ 200-240V~ or 240Vdc Input
+ 12V/ 105.4A + 12Vsb/ 3A
NOTE: The default power supply is based on a basic system configuration. Please contact with technical representatives to determine the best power supply selection for your system configuration requirements and preferred efficiency.
AC Input:
- 100-240V~/ 12-7A, 50-60Hz
- 200-240V~/ 8A, 50-60Hz
DC Input:
- 240Vdc/ 6.5A
DC Output:
- Max 1000W/ 100-240V~
+ 12V/ 80.5A
+ 12Vsb/ 3A
- Max 1300W/ 200-240V~ or 240Vdc Input
+ 12V/ 105.4A + 12Vsb/ 3A
NOTE: The default power supply is based on a basic system configuration. Please contact with technical representatives to determine the best power supply selection for your system configuration requirements and preferred efficiency.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
989 x 594 x 279 mm
Packaging Content
1 x R263-Z32
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
1 x Rail kit
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
1 x Rail kit
Part Numbers
- Barebone package: 6NR263Z32DR000AAC1*
- Motherboard: 9MZ33DC0UR-000
- Rail kit: 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-143100-A0R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board: 9CFP2001NR-00
- Backplane board: 9CBP20O7NR-00
- Fan module: 25ST2-88382T-S1R
- Riser card - CRS201M: 9CRS201MNR-00
- Riser card - CRS201H: 9CRS201HNR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-213004-F3S
- Motherboard: 9MZ33DC0UR-000
- Rail kit: 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-143100-A0R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board: 9CFP2001NR-00
- Backplane board: 9CBP20O7NR-00
- Fan module: 25ST2-88382T-S1R
- Riser card - CRS201M: 9CRS201MNR-00
- Riser card - CRS201H: 9CRS201HNR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-213004-F3S
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
SUPPORT
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
- Windows 11 64bit
- Linux
芯片组
芯片组
版本
档案大小
日期
AMD Chipset Driver
Version : 4.06.27.500
16.58 MB
Nov 11, 2022
操作系统: Windows Server 2019,Windows Server 2022
网卡
网卡
版本
档案大小
日期
Intel® LAN Driver and Utility
Version : 27.4
755.19 MB
Nov 11, 2022
操作系统: Windows Server 2019,Windows Server 2022
BIOS
说明
版本
档案大小
日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.
什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.
什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.61
111.38 MB
May 22, 2023
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
说明
版本
档案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2600 AMI)
(AST2600 AMI)
Version : 13.04.15
111.05 MB
May 19, 2023
英语
使用手冊
说明
版本
档案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
17.42 MB
Sep 08, 2021
英语
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