R272-Z30
(rev. A00)
(rev.100)
AMD EPYC™ 7003 UP Server System - 2U 12-Bay
| Application:
网络服务器
Application:
- AMD EPYC™ 7003 processors with AMD 3D V-Cache™ Technology
- AMD EPYC™ 7003 series processor family
- Single processor, 7nm technology
- 8-Channel RDIMM/LRDIMM DDR4, 16 x DIMMs
- 2 x 1Gb/s LAN ports (Intel® I350-AM2)
- 1 x Dedicated management port
- 12 x 3.5"/2.5" SATA hot-swappable bays
- 2 x 2.5" SATA hot-swappable bays on rear side
- 2 x M.2 slots with PCIe Gen3 x4 interface
- 4 x LP PCIe Gen4 x16 and x8 slots
- 2 x LP PCIe Gen3 x16 and x8 slots
- 1 x OCP 2.0 Gen3 x16 mezzanine slot
- Aspeed® AST2500 remote management controller
- 2 x 800W 80 PLUS Platinum redundant power supplies
1/5
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U
438 x 87.5 x 660
Motherboard
CPU
AMD EPYC™ 7003 processors with AMD 3D V-Cache™ Technology
AMD EPYC™ 7003 series processor family
Single processor, 7nm technology
Up to 64-core, 128 threads per processor
cTDP up to 280W
Compatible with AMD EPYC™ 7002 series processor family
AMD EPYC™ 7003 series processor family
Single processor, 7nm technology
Up to 64-core, 128 threads per processor
cTDP up to 280W
Compatible with AMD EPYC™ 7002 series processor family
Socket
1 x LGA 4094
Socket SP3
Socket SP3
Chipset
System on Chip
Memory
16 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200*/2933 MHz
*Follow BIOS setting and memory QVL list if running 3200 Mhz with 2DPC
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200*/2933 MHz
*Follow BIOS setting and memory QVL list if running 3200 Mhz with 2DPC
LAN
Rear side:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x 10/100/1000 management LAN
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Front side:
4 x 3.5"/2.5" SATA/SAS hot-swappable bays
8 x 3.5"/2.5" SATA/SAS hot-swappable bays, from optional SAS HBA
Rear side:
2 x 2.5" SATA/SAS hot-swappable bays
Front side default configuration supports:
4 x SATA drives
8 x SAS drives via optional SAS HBA
SAS card is required for SAS devices support
4 x SATA on front side and 2 x SATA on rear side are available in default setting
4 x 3.5"/2.5" SATA/SAS hot-swappable bays
8 x 3.5"/2.5" SATA/SAS hot-swappable bays, from optional SAS HBA
Rear side:
2 x 2.5" SATA/SAS hot-swappable bays
Front side default configuration supports:
4 x SATA drives
8 x SAS drives via optional SAS HBA
SAS card is required for SAS devices support
4 x SATA on front side and 2 x SATA on rear side are available in default setting
SAS
Depends on SAS add-on card
RAID
N/A
Expansion Slots
Total 4 x PCIe Gen4 low-profile slots
Slot_6: 1 x PCIe x16 (Gen4 x16) slot
Slot_5: 1 x PCIe x16 (Gen4 x8) slot
Slot_4: 1 x PCIe x16 (Gen4 x16) slot
Slot_3: 1 x PCIe x16 (Gen4 x16) slot
Total 2 x PCIe Gen3 low-profile slots
Slot_2: 1 x PCIe x8 (Gen3 x0 or x8) slot
Slot_1: 1 x PCIe x16 (Gen3 x16 or x8) slot, shared with slot_2
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4; Type2 P5 with NCSI supported)
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280 cards
Slot_6: 1 x PCIe x16 (Gen4 x16) slot
Slot_5: 1 x PCIe x16 (Gen4 x8) slot
Slot_4: 1 x PCIe x16 (Gen4 x16) slot
Slot_3: 1 x PCIe x16 (Gen4 x16) slot
Total 2 x PCIe Gen3 low-profile slots
Slot_2: 1 x PCIe x8 (Gen3 x0 or x8) slot
Slot_1: 1 x PCIe x16 (Gen3 x16 or x8) slot, shared with slot_2
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4; Type2 P5 with NCSI supported)
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280 cards
Internal I/O
2 x M.2 slots
1 x USB 3.0 header
1 x USB 2.0 header
1 x COM_2 header
1 x TPM header
1 x Front panel header
1 x Backplane board header
1 x PMBus connector
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
1 x Buzzer
1 x USB 3.0 header
1 x USB 2.0 header
1 x COM_2 header
1 x TPM header
1 x Front panel header
1 x Backplane board header
1 x PMBus connector
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
1 x Buzzer
Front I/O
2 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x HDD activity LED
1 x System status LED
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x HDD activity LED
1 x System status LED
Rear I/O
3 x USB 3.0
1 x VGA
1 x COM
2 x RJ45
1 x MLAN
1 x ID button with LED
1 x VGA
1 x COM
2 x RJ45
1 x MLAN
1 x ID button with LED
Backplane I/O
Speed and bandwidth:
Front side - CBP20C4: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBP2021: SATA 6Gb/s or SAS 12Gb/s
Front side - CBP20C4: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBP2021: SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
2 x 800W 80 PLUS Platinum Redundant power supplies
AC Input:
- 100-240V~/ 10-4A, 50-60Hz
DC Input:
- 240Vdc/ 4.5A
DC Output:
- Max 800W
+ 12V/ 66A
+ 12Vsb/ 2.5A
NOTE: Select 1200W power supply if using 280W CPU with full loading configuration
AC Input:
- 100-240V~/ 10-4A, 50-60Hz
DC Input:
- 240Vdc/ 4.5A
DC Output:
- Max 800W
+ 12V/ 66A
+ 12Vsb/ 2.5A
NOTE: Select 1200W power supply if using 280W CPU with full loading configuration
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
System Fans
4 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
982 x 588 x 268 mm
Packaging Content
1 x R272-Z30
1 x CPU heatsink
1 x Rail kit
1 x CPU heatsink
1 x Rail kit
Part Numbers
- Barebone package: 6NR272Z30MR-00-A*
- Barebone with 850W Titanium PSU: 6NR272Z30MR-00-AT0
- Motherboard: 9MZ32AR0NR-00
- Rail kit: 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-15320E-J1R
- Front panel board - CFP2001: 9CFP2001NR-00
- Backplane board - CBP20C4: 9CBP20C4NR-00
- Backplane board - CBP2021: 9CBP2021NR-00
- Fan module: 25ST2-883829-D0R
- Power supply: 25EP0-208004-L0S
- Power supply 850W Titanium: 25EP0-208503-D0S (optional)
- Fan duct for 280W CPU: 25HA8-R27231-S5R
- 4 x U.2 Kit: 6NR272Z3BSR-00 (optional)
- Power cord 125V/15A (JP): 25CPA-018304-Q0R (optional)
- Barebone with 850W Titanium PSU: 6NR272Z30MR-00-AT0
- Motherboard: 9MZ32AR0NR-00
- Rail kit: 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-15320E-J1R
- Front panel board - CFP2001: 9CFP2001NR-00
- Backplane board - CBP20C4: 9CBP20C4NR-00
- Backplane board - CBP2021: 9CBP2021NR-00
- Fan module: 25ST2-883829-D0R
- Power supply: 25EP0-208004-L0S
- Power supply 850W Titanium: 25EP0-208503-D0S (optional)
- Fan duct for 280W CPU: 25HA8-R27231-S5R
- 4 x U.2 Kit: 6NR272Z3BSR-00 (optional)
- Power cord 125V/15A (JP): 25CPA-018304-Q0R (optional)
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SUPPORT
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
芯片组
网卡
BIOS
说明
版本
档案大小
日期
1. Updated Milan AGESA 1.0.0.A
2. Updated Rome AGESA 1.0.0.G
3. Updated Rome Microcode 0830107A for CVE-2023-20593 issue
2. Updated Rome AGESA 1.0.0.G
3. Updated Rome Microcode 0830107A for CVE-2023-20593 issue
Version : M18_R34
35.18 MB
Aug 14, 2023
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
注意:
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.64
111.38 MB
Sep 05, 2023
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
说明
版本
档案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.01
103.98 MB
Jul 27, 2023
英语
使用手冊
说明
版本
档案大小
日期
支持列表
说明
版本
档案大小
日期
RESOURCES
Back to R272-Z30
