S453-S70
(rev. AAV1)

Storage Server - 4th/5th Gen Intel® Xeon® Scalable - 4U DP 36+2-Bay SATA/SAS
  • 5th Gen Intel® Xeon® Scalable Processors
  • 4th Gen Intel® Xeon® Scalable Processors
  • Dual processor, LGA 4677
  • 8-Channel RDIMM DDR5 per processor, 16 x DIMMs
  • 2 x 10Gb/s LAN ports (Intel® X710-AT2)
  • 2 x 1Gb/s LAN ports (Intel® I210-AT)
  • 1 x Dedicated management port
  • 24 x 3.5"/2.5" SATA/SAS hot-swappable bays on front side
  • 12 x 3.5"/2.5" SATA/SAS hot-swappable bays on rear side
  • 2 x 2.5" SATA/SAS bays on rear side for boot drives
  • SAS expander with 12Gb/s transfer speed
  • 2 x M.2 slots with PCIe Gen4 x4 interface
  • 6 x LP PCIe Gen5 x16 slots
  • Dual 1600W 80 PLUS Titanium redundant power supply
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
4U
482.6 x 177 x 625
Motherboard
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Dual processor, CPU TDP up to 270W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
2 x LGA 4677
Socket E
Chipset
Intel® C741 Chipset
Memory
16 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM modules up to 96GB supported*

5th Gen Intel® Xeon®: Up to 5600MHz
4th Gen Intel® Xeon®: Up to 4800MHz

*Total memory supports up to 512GB with 1600W power supply. Please select 2000W power supply for higher memory configuration.
LAN
Rear side:
2 x 10Gb/s LAN ports (1 x Intel® X710-AT2)
2 x 1GbE LAN ports (2 x Intel® I210-AT)
NCSI function supported (by switch setting)

1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
Front side:
24 x 3.5"/2.5" SATA/SAS hot-swappable bays, connected to expander

Rear side:
12 x 3.5"/2.5" SATA/SAS hot-swappable bays, connected to expander
2 x 2.5" SATA/SAS bays for boot drives, from onboard connector
- (Additional SAS card is required for SAS support on boot drives)

1 x Broadcom SAS35x48 expanders
Bandwidth: SATA 6Gb/s or SAS 12Gb/s per port

SAS card is required to enable the drive bays

Recommended SAS cards:
CSA4710
CRA4760
CRA4761
SAS
Supported
RAID
Depends on SAS add-on Card
Expansion Slots
6 x PCIe x16 (Gen5 x16) low-profile slots

2 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22100 cards
Internal I/O
1 x TPM header
1 x VROC connector
Front I/O
2 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x HDD status LED
1 x System status LED
Rear I/O
2 x USB 3.2 Gen1
1 x VGA
1 x COM
4 x RJ45
1 x MLAN
1 x ID button with LED
Backplane Board
Speed and bandwidth:
Front side - CBPD4O0: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBP2021: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBPD0C0: SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
Dual 1600W 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 10A, 50-60Hz

DC Input:
- 240Vdc/ 8A

DC Output:
- Max 1000W/ 100-127V~
+ 12.2V/ 82A
+ 12.2Vsb/ 3A
- Max 1600W/ 200-240V~ or 240Vdc Input
+ 12.2V/ 132A
+ 12.2Vsb/ 3A
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x38mm (16,300rpm)
4 x 80x80x38mm (9,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
843 x 610 x 290 mm
Packaging Content
1 x S453-S70
2 x CPU heatsinks
6 x Carrier clips
1 x 3-Section Rail kit
Part Numbers
- Barebone package (4th/5th Gen): 6NS453S70MR000ABV1*
- Barebone package (4th Gen): 6NS453S70MR000AAV1*
- Motherboard: 9MS73HB0NR-000
- 3-Section Rail kit: 25HB2-3A6104-I0R
- CPU heatsink: 25ST1-323208-A0R
- Backplane board - CBP2021: 9CBP2021NR-00
- Backplane board - CBPD0C0: 9CBPD0C0NR-00
- Backplane board - CBPD4O0: 9CBPD4O0NR-00
- Fan module: 25420-8038B-D00R
- Fan module: 25ST2-883829-D0R
- 1600W power supply: 25EP0-21600D-G1S

Optional parts:

- 2000W power supply (GosPower): 25EP0-22000L-G1S
- 2000W power supply (LITEON): 25EP0-22000M-L0S
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Linux
RAID
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.73
147.86 MB
Mar 05, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手冊
说明
版本
档案大小
日期
说明
版本
档案大小
日期
操作系统支持列表
Version : 1.5
0.22 MB
Jan 04, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series

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