S453-Z30
(rev. AAV1)
- AMD EPYC™ 9004 series processors
- AMD EPYC™ 9004 series processors with AMD 3D V-Cache™ Technology
- Single processor, 5nm technology
- 12-Channel RDIMM DDR5, 24 x DIMMs
- 2 x 10Gb/s LAN ports (Broadcom® BCM57416)
- 1 x Dedicated management port
- 24 x 3.5"/2.5" SATA/SAS hot-swappable bays on front side
- 12 x 3.5"/2.5" SATA/SAS hot-swappable bays on rear side
- 2 x 2.5" SATA/SAS bays on rear side for boot drives
- SAS expander with 12Gb/s transfer speed
- 1 x M.2 slot with PCIe Gen4 x4 interface
- 4 x LP PCIe Gen5 x16 slots
- Dual 1600W (240V) 80 PLUS Titanium redundant power supply
1/4
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
4U
482.6 x 177 x 625
482.6 x 177 x 625
Motherboard
CPU
AMD EPYC™ 9004 series processors
AMD EPYC™ 9004 series processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
*Up to 128-core, 256 threads per processor
cTDP up to 300W at ambient 35°C
*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.
AMD EPYC™ 9004 series processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
*Up to 128-core, 256 threads per processor
cTDP up to 300W at ambient 35°C
*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.
Socket
1 x LGA 6096
Socket SP5
Socket SP5
Chipset
System on Chip
Memory
24 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz (1DPC), 3600 MHz (2DPC)
DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz (1DPC), 3600 MHz (2DPC)
LAN
Rear side:
2 x 10Gb/s BASE-T LAN ports (1 x Broadcom® BCM57416)
NCSI function supported
1 x 10/100/1000 management LAN
2 x 10Gb/s BASE-T LAN ports (1 x Broadcom® BCM57416)
NCSI function supported
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
Front side:
24 x 3.5"/2.5" SATA/SAS hot-swappable bays, connected to expander
Rear side:
12 x 3.5"/2.5" SATA/SAS hot-swappable bays, connected to expander
2 x 2.5" SATA/SAS bays for boot drives, from onboard connector
- (Additional SAS card is required for SAS support on boot drives)
1 x Broadcom SAS35x48 expanders
Bandwidth: SATA 6Gb/s or SAS 12Gb/s per port
SAS card is required to enable the drive bays
Recommended SAS cards:
CSA4710
CRA4760
CRA4761
24 x 3.5"/2.5" SATA/SAS hot-swappable bays, connected to expander
Rear side:
12 x 3.5"/2.5" SATA/SAS hot-swappable bays, connected to expander
2 x 2.5" SATA/SAS bays for boot drives, from onboard connector
- (Additional SAS card is required for SAS support on boot drives)
1 x Broadcom SAS35x48 expanders
Bandwidth: SATA 6Gb/s or SAS 12Gb/s per port
SAS card is required to enable the drive bays
Recommended SAS cards:
CSA4710
CRA4760
CRA4761
SAS
Supported
RAID
Depends on SAS add-on Card
Expansion Slots
4 x PCIe x 16 (Gen5 x16) low-profile slots
1 x M.2 slot:
- M-key
- PCIe Gen4 x4
- Supports 2280/22100 cards
1 x M.2 slot:
- M-key
- PCIe Gen4 x4
- Supports 2280/22100 cards
Internal I/O
1 x M.2 slot
1 x TPM header
1 x TPM header
Front I/O
2 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x HDD status LED
1 x System status LED
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x HDD status LED
1 x System status LED
Rear I/O
2 x USB 3.2 Gen1
1 x VGA
1 x COM
2 x RJ45
1 x MLAN
1 x ID button with LED
1 x VGA
1 x COM
2 x RJ45
1 x MLAN
1 x ID button with LED
Backplane I/O
Speed and bandwidth:
Front side - CBPD4O0: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBP2021: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBPD0C0: SATA 6Gb/s or SAS 12Gb/s
Front side - CBPD4O0: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBP2021: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBPD0C0: SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
Dual 1600W 80 PLUS Titanium redundant power supply
AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 10A, 50-60Hz
DC Input: - 240Vdc/ 8A DC Output: - Max 1000W/ 100-127V~ + 12.2V/ 82A + 12.2Vsb/ 3A - Max 1600W/ 200-240V~ or 240Vdc Input + 12.2V/ 132A + 12.2Vsb/ 3A
DC Input: - 240Vdc/ 8A DC Output: - Max 1000W/ 100-127V~ + 12.2V/ 82A + 12.2Vsb/ 3A - Max 1600W/ 200-240V~ or 240Vdc Input + 12.2V/ 132A + 12.2Vsb/ 3A
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x38mm (16,300rpm)
4 x 80x80x38mm (9,000rpm)
4 x 80x80x38mm (9,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
843 x 610 x 290 mm
Packaging Content
1 x S453-Z30
1 x CPU heatsink
1 x 3-Section Rail kit
1 x CPU heatsink
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NS453Z30MR000AAV1*
- Motherboard: 9MZ33AR0NR-000
- 3-Section Rail kit: 25HB2-3A6104-I0R
- CPU heatsink: 25ST1-143100-A0R
- Backplane board - CBP2021: 9CBP2021NR-00
- Backplane board - CBPD0C0: 9CBPD0C0NR-00
- Backplane board - CBPD4O0: 9CBPD4O0NR-00
- Fan module: 25420-8038B-D00R
- Fan module: 25ST2-883829-D0R
- Power supply: 25EP0-21600D-G1S
- Motherboard: 9MZ33AR0NR-000
- 3-Section Rail kit: 25HB2-3A6104-I0R
- CPU heatsink: 25ST1-143100-A0R
- Backplane board - CBP2021: 9CBP2021NR-00
- Backplane board - CBPD0C0: 9CBPD0C0NR-00
- Backplane board - CBPD4O0: 9CBPD4O0NR-00
- Fan module: 25420-8038B-D00R
- Fan module: 25ST2-883829-D0R
- Power supply: 25EP0-21600D-G1S
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SUPPORT
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
芯片组
芯片组
版本
档案大小
日期
AMD Chipset Driver
Version : 4.06.27.500
16.58 MB
Nov 11, 2022
操作系统: Windows Server 2019,Windows Server 2022
网卡
网卡
版本
档案大小
日期
Broadcom® BCM57416 LAN Card Driver
Version : 1.0
0.65 MB
Nov 11, 2022
操作系统: Windows Server 2019,Windows Server 2022
BIOS
说明
版本
档案大小
日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
注意:
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.64
111.38 MB
Sep 05, 2023
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
说明
版本
档案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2600 AMI)
(AST2600 AMI)
Version : 13.05.04
112.93 MB
Aug 16, 2023
英语
使用手冊
说明
版本
档案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
17.39 MB
Aug 29, 2023
英语
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