H27N-H70
(rev. 111)

已停产

2U 4 Nodes High Density Rack Server

2U - 4 nodes with front access to the node trays
Intel^® Xeon^® processor E5-2600 V3 / V4 product family
8 x LGA 2011-3 sockets
Intel^® C612 chipset
64 x DDR4 ECC slots
8 x GbE LAN ports (Intel^® I350-AM2)
8 x 2.5” hot-swappable NVMe bays
8 x 2.5” hot-swappable SATA bays
1600W 80 PLUS Platinum redundant PSU

* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U
447 x 87.2 x 780

Motherboard

MH70-HD1

CPU

Intel^® Xeon^® E5-2600 V3 processors
Intel^® Xeon^® E5-2600 V4 processors
NOTE: If only 1 CPU is installed, some PCIe, memory, network or I/O functions might be unavailable.

Socket

Per node:
2 x LGA 2011-3
Total:
8 x LGA 2011-3
Mounting pitch: narrow ILM (56x94mm)
Max. length of M4 screw threads: 3.7mm
Screws longer than 3.7mm might damage the motherboard

Chipset

Intel^® C612

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots
DDR4 memory supported only
Quad channel memory architecture
RDIMM modules up to 32GB supported
LRDIMM modules up to 64GB supported
3DS LRDIMM modules up to 128GB supported
1.2V modules: 1600/1866/2133/2400 MHz

LAN

Per node:
2 x GbE LAN ports (Intel^® I350-AM2)
1 x 10/100/1000 management LAN

Total:
8 x GbE LAN ports (Intel^® I350-AM2)
4 x 10/100/1000 management LAN

Video

Integrated in Aspeed^® AST2400
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Audio

Storage

Per node:
2 x 2.5" hot-swappable NVMe bays
2 x 2.5" hot-swappable SATA bays

Total:
8 x 2.5" hot-swappable NVMe bays
8 x 2.5" hot-swappable SATA bays

SATA

Per node:
6 x SATA III 6Gb/s ports

Total:
24 x SATA III 6Gb/s ports

SAS

RAID

Intel^® SATA RAID 0/1/5/10

Peripheral Drives

Expansion Slots

Per node:
1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus) connector
1 x Mezzanine PCIe x8 (Gen3 x8 bus) connector

Total:
4 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) connectors
4 x Mezzanine PCIe x8 (Gen3 x8 bus) connectors

Internal I/O

Per node:
2 x 18-pin power connectors
1 x Mini-SAS connector
6 x SATA III 6Gb/s ports
1 x USB 3.0 header
1 x Serial header
1 x VGA header
1 x TPM header
1 x Front panel header
1 x SATA power header
1 x SATA SGPIO header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x PMBUS header
1 x PMBUS selection jumper
1 x BMC FRB jumper
1 x Software RAID jumper
1 x Clear CMOS jumper
1 x Power on selection jumper
1 x ACK selection jumper
1 x IPMB connector

Front I/O

Per node:
2 x USB 3.0
1 x VGA
1 x Power button with LED
1 x ID button with LED

Total:
8 x USB 3.0
4 x VGA
4 x Power buttons with LED
4 x ID buttons with LED

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
1 x Serial
3 x RJ45
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x System status LED
2 x LAN activity LEDs

Total:
8 x USB 3.0
4 x VGA
4 x Serial
12 x RJ45
4 x Power buttons with LED
4 x ID buttons with LED
4 x NMI buttons
4 x Reset buttons
4 x System status LEDs
8 x LAN activity LEDs

Backplane Board

Per node:
2 x SAS/SATA ports
2 x NVMe ports

TPM

1 x TPM header

Power Supply

2 x 1600W redundant PSU
80 PLUS Platinum

AC input:
- 100-127V/ 12A, 47-63Hz
- 200-240V/ 9.48A, 47-63Hz

DC output:
- 1000W@100-127V
- 1600W@200-240V

System Management

Aspeed^® AST2400 management controller
Avocent^® MergePoint IPMI 2.0 web interface:
- Network settings
- Network security settings
- Users control
- Services settings
- IPMI settings
- Sessions control
- LDAP settings
- Power control
- Voltages, fans and temperatures monitoring
- System event log
- Events management (platform events, trap settings, email settings)
- Serial Over LAN
- vKVM & vMedia (launch, configuration)

OS Compatibility

Windows Server 2008 R2 (x64)
Windows Server 2012 (x64)
Windows Server 2012 R2 (x64)
Windows Server 2016

Red Hat Enterprise Linux 6.7 (x86/x64)
Red Hat Enterprise Linux 7.2 (x64)

SUSE Linux Enterprise Server 11.4 (x86/x64)
SUSE Linux Enterprise Server 12 (x64)

Ubuntu 12.04 LTS (x86/x64)
Ubuntu 14.04 LTS (x86/x64)

VMware ESXi 5.1 U2
VMware ESXi 5.5 U2
VMware ESXi 6.0 U1

System Fans

16 x 40x40x56mm (23,000rpm)

Operating Properties

Operating temperature: 5°C to 35°C
Non-operating temperature: 0°C to 40°C
10-80% operating humidity at 30°C

Weight

38kg

Packaging Dimensions

1133 x 724 x 261 mm

Packaging Content

1 x H27N-H70
8 x CPU heatsinks
1 x Quick Installation Guide
1 x Rail kit

Part Numbers

Barebone: 6NH27NH70MR-00
Spare parts:
- Tool-less rail kit: 25HB2-A86100-K0R
- CPU heatsink 1: 25ST1-443205-T4R
- CPU heatsink 2: 25ST1-443206-C1R
- Power supply: 25EP0-216003-D0S
- NVMe card: 9CNV6112NR-00

SUPPORT

下载

驱动程序
BIOS
工具程序
Firmware

使用手冊
支持列表

Online Support

驱动程序

BIOS

工具程序

Firmware

QVL

All
All
Windows Server 2016 64bit
Windows Server 2012 R2 64bit
Windows Server 2012 64bit
Windows Server 2008 R2 64bit
Ubuntu 14.04 LTS x86
Ubuntu 14.04 LTS x64
Ubuntu 12.04 LTS x86
Ubuntu 12.04 LTS x64
SLES 12 x64
SLES 11.4 x86
SLES 11.4 x64
RHEL 7.2 x64
RHEL 6.7 x86
RHEL 6.7 x64

芯片组

版本

档案大小

日期

Intel® INF Driver

Version : 10.1.2.10

2.76 MB

Mar 31, 2016

H27N-H70 (rev. 111)

SPECIFICATIONS

SUPPORT

RESOURCES

H27N-H70 (rev. 111)

H27N-H70
(rev. 111)