MW51-HP0
(rev. 1.x)

已停产

Intel® C422 Chipset
  • Intel® Xeon® W-2200 and W-2100 Processors
  • Single processor, LGA 2066
  • Intel® C422 Chipset
  • Quad Channel RDIMM/LRDIMM DDR4, 8 x DIMMs
  • Intel® VROC ready
  • ASMedia 2142 USB 3.1 Gen3 controller
  • Realtek ALC1150 HD audio codec
  • 2 x 1GbE LAN ports (Intel® I210)
  • 8 x SATA III 6Gb/s ports from C422, supports 2 x SATA DOM
  • 2 x SATA III 6Gb/s ports from Marvell® 88SE9172 controller
  • 1 x M.2 slot with PCIe Gen3 x4 interface
  • 1 x U.2 connector with PCIe Gen3 x4 interface
  • 7 x PCIe Gen3 x16 and x8 expansion slots
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Board Size
CEB
304.8W x 266.7D mm
Processor Supported
Intel® Xeon® W-2200 and W-2100 Processors
Single processor, TDP up to 165W
Socket
1 x LGA 2066
Socket R4
Mounting pitch: square ILM (80x80mm)
Chipset Description
Intel® C422 Chipset
Memory Type
8 x DIMM slots
DDR4 memory module supported only
Quad channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
1.2V modules: 2666/2400 MHz

NOTE: When installing memory modules, make sure to begin with the first socket of each channel, such as DIMM_P0_A0, DIMM_P0_B0, DIMM_P0_C0, DIMM_P0_D0
Integrated Network
2 x 1GbE LAN ports (Intel® I210)
Integrated Video Controller
N/A
Integrated Audio Controller
Realtek® ALC1150 HD audio codec
Supports 7.1 channel configurations
Integrated SAS Controller
N/A
Integrated SATA Controller
8 x SATA III 6Gb/s ports with 2 x SATA DOM supported
2 x SATA III 6Gb/s ports (Marvell 88SE9172® controller)
Support RAID Function
Intel® SATA RAID 0/1/10/5
Expansion Slot
Slot_7: 1 x PCIe x16 (Gen3 x16 bus) slot, from CPU
Slot_6: 1 x PCIe x16 (Gen3 x0 or x8 bus) slot, from CPU
Slot_5: 1 x PCIe x16 (Gen3 x16 or x8 bus) slot, from CPU, shared with slot_6
Slot_4: 1 x PCIe x16 (Gen3 x0 or x8 bus) slot, from PEX8747
Slot_3: 1 x PCIe x16 (Gen3 x16 or x8 bus) slot, from PEX8747, shared with slot_4
Slot_2: 1 x PCIe x16 (Gen3 x0 or x8 bus) slot, from PEX8747
Slot_1: 1 x PCIe x16 (Gen3 x16 or x8 bus) slot, from PEX8747, shared with slot_2

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from C422
- Supports NGFF-2242/2260/2280/22110 cards

1 x U.2 connector:
- Mini-SAS HD type
- PCIe Gen3 x4, from C422

Supports NVIDIA® SLI™ and AMD® CrossFireX™ technologies
NOTE: Graphic card requests UEFI-ready
On-Board Connector
1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors for CPU and DDR 12V input
1 x 6-pin power connector for PCIe slots 12V input
1 x CPU fan header
5 x System fan headers
2 x USB 3.0 headers for 4 ports
1 x USB 2.0 header for 2 ports
1 x Front audio header
1 x PMBus connector
1 x Clear CMOS jumper
10 x SATA III 6Gb/s ports
2 x SATA DOM jumpers
2 x SATA DOM SGPIO connectors
1 x ME update jumper
1 x M.2 slot
1 x U.2 connector
1 x Front panel header
1 x Backplane board header
2 x COM headers
1 x TPM header
1 x VROC connector
1 x BIOS recovery jumper
1 x Buzzer
Rear I/O Connectors
1 x PS/2
8 x USB 3.0
2 x USB 3.1 (red) in Type-A and Type-C (5V/3A)
2 x RJ45
5 x Audio jacks
1 x Optical S/PDIF-Out
TPM
1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
OS Driver Supported
Windows 10 (x64)

Based on Microsoft support policy, GIGABYTE recommends users to upgrade Skylake-based systems to Windows 10 before July 17th, 2018 to continue receiving support

Red Hat Enterprise Linux 6.8 (x64)
Red Hat Enterprise Linux 7.3 (x64)

SUSE Linux Enterprise Server 11.4 (x64)
SUSE Linux Enterprise Server 12.2 (x64)

Ubuntu 16.04 LTS (x64)
Ubuntu 16.10 LTS (x64)
Server Management
N/A
PSU Connector
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Bundle
1 x MW51-HP0
1 x Driver CD
1 x I/O shield
1 x Quick start guide
8 x SATA III 6Gb/s cables (500mm)
1 x External thermistor cable (2P/900mm)

Single Box dimensions: 360 x 330 x 80 mm
Carton dimensions: 674 x 424 x 385 mm
Quantity: 10 x single boxes in one carton
Bulk Packaging Content
10 x MW51-HP0
10 x I/O shields

Carton dimensions: 600 x 473 x 495 mm
Ordering Information
Retail: 9MW51HP0MR-00
Bulk: 9MW51HP0NR-00

Part numbers:
I/O shield: 12AIO-MW51H0-00R
Fan-sink: 25ST0-7C9220-T1R (optional)
Driver CD: 12DC1-08MW51-00H (Retail)
SATA III 6Gb/s cable (500mm): 12CF1-2SAT01-31R (Retail)
External thermistor cable: 12CF1-1TM001-01R (Retail)
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • All
  • All
  • Windows Server 2019
  • Windows Server 2016 64bit
  • Windows 11 64bit
  • Windows 10 64bit
网卡
网卡
版本
档案大小
日期
BIOS
说明
版本
档案大小
日期
R02 BIOS release:
1. Updated RC version 1464.D01 for Intel security CVR-2020-0543/0548/0549)
2. Modified TLS function at BIOS Advance page
3. Modified SMBIOS TYPE 0 BIOS version
4. Modify complier BIOSGuard error

[IMPORTANT]
Please read Server_MB_Update_BIOS_SOP_MW51-HP0.pdf before updating BIOS from Fxx to Rxx
Version : R02
16.03 MB
Apr 20, 2020
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

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