MXM-A-A370M
MXM module type A with Intel® Arc™ A370M Graphics
Intel® Arc™ A370M Graphics
GDDR6 4GB 64 bit Memory
Support Xe HPG Architecture
Support for XMX AI acceleration
Support 4 x DP2.0 (8K) resolution
(For more product information, please contact us at sales@gigaipc.com)
(For more product information, please contact us at sales@gigaipc.com)
SPECIFICATIONS
Operating Properties
Operating temperature: 0°C to 60°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Memory Type
GDDR6 4GB, 64bit memory bus
Memory speed: 14 Gbps
Bandwidth: 112 GB/s
Memory speed: 14 Gbps
Bandwidth: 112 GB/s
OS Driver Supported
Windows 10/11 (x64)
Packaging Bundle
Carton size: 384 x 251 x 211 (mm)
Packing Capacity: 20pcs
Single Box size : 168 x 112 x 34 (mm)
Ordering Information
9CMBIE1MR-SI (Box packing)
Dimension
MXM module type A
82 x 70(mm)
82 x 70(mm)
GPU
Intel® Arc™ A370M Graphics
Microarchitecture: Xe HPG
Xe-cores: 8
Intel® XMX Engines: 128
Graphics clock: 1550 MHz
TGP: 35-50W
Microarchitecture: Xe HPG
Xe-cores: 8
Intel® XMX Engines: 128
Graphics clock: 1550 MHz
TGP: 35-50W
PCI Express configurations
PCI Express 4.0x8
Graphics
Reserved 4 x DP 2.0
supporting a maximum resolution of 7680x4320 @60Hz
(4 independent display outputs)
supporting a maximum resolution of 7680x4320 @60Hz
(4 independent display outputs)
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* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。