QBiP-x6413EAT

3.5” SubCompact Wide Temperature Embedded Motherboard with Intel® Atom® x6413E Processor, Dual Channel DDR4 memory, 4 x COM, 1 x SATA 6Gb/s, 4 x USB 3.2 Gen 1, 2 x USB 2.0, Temp -40°C to 85°C

3.5" SBC

Intel® Atom® x6413E

Dual Channel DDR4, 2 x SO-DIMMs

2 x GbE LAN Ports

1 x SATA 6Gb/s Port

M.2 with PCIe x2, SATA 6Gb/s

2 x HDMI, LVDS ports for multiple display

1 x COM Port (RS-232/422/485 & RI/5V/12V)

1 x COM Port (RS-232/422/485)

2 x COM Ports (RS-232)

Wide Temperature Embedded Motherboard

(For more product information, please contact us at sales@gigaipc.com)

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SPECIFICATIONS

Board Size

3.5" SBC
146W x 101.7Dmm

Operating Properties

Operating temperature: -40°C to 85°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)

Processor Supported

Intel® Atom® x6413E Processor
10nm, 4 cores, 4 threads, up to 3.0 GHz
TDP 9W

Socket

1 x FCBGA1493

Memory Type

2 x DDR4 SO-DIMM sockets, Max. Capacity 32 GB
Support Dual channel DDR4 3200 MHz memory modules

Integrated Network

2 x GbE LAN Ports (Intel® I210AT)

Integrated Video Controller

Integrated Graphics Processor -
Intel® UHD Graphics for 10th Gen Intel® Processors:
2 x HDMI 2.0 port, supporting a maximum resolution of 4096x2160 @60Hz
1 x LVDS port, supporting a maximum resolution of 1920x1200 @60Hz (3 independent display outputs)

Integrated Audio Controller

Realtek® Audio Codec

Expansion Slot

1 x 2280 M.2 M-Key (PCIe x2, SATA 6Gb/s)
1 x Full-size mini PCIe with SIM slot

On Board Connectors

1 x 4-pin box power connector (DC in +9V~36VDC)
1 x SATA Power header
1 x CPU fan header
1 x Front panel header
1 x Front panel audio header
1 x 2W Speaker out header
2 x USB 2.0 headers
1 x COM header (RS-232/422/485 & RI/5V/12V)
1 x COM header (RS-232/422/485)
2 x COM headers (RS-232)
1 x Backlight Control header
1 x AT/ATX mode select jumper
1 x GPIO (8 bits) & SMBus header
1 x Buzzer header

＊Conditional DC-input 9V support with :
(1) SATA_PWR support 5V only
(2) LVDS backlight cannot support
(3) Total power consumption under 50W

Rear I/O Connectors

1 x Headphone Jack
2 x HDMI
2 x RJ45 LAN Ports
4 x USB 3.2 Gen 1

OS Driver Supported

Windows 10 (x64)

Packaging Bundle

Carton size: 375 x 324 x 293 (mm)
Packing Capacity: 10pcs

Single Box size: 256 x 175 x 59 (mm)

Including:
SATA power Cable x 1 (P/N: 25CRI-200B02-K1R)
Fanless Heatsink x 1 (P/N: 25ST1-12311E-A7R)

Ordering Information

9MEHLEASMR-SI1 (Box Packing)

Storage

1 x SATA 6Gb/s Port

* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。