TO25-S11
(rev. AA01)

ORv3 Compute Node - 5th/4th Gen Intel^® Xeon^® Scalable - 2OU 2-Node UP 10-Bay E1.S NVMe

Single 5th/4th Gen Intel^® Xeon^® Scalable Processors
Single Intel^® Xeon^® CPU Max Series
8-Channel RDIMM DDR5, 8 x DIMMs
Dual ROM Architecture
10 x E1.S NVMe hot-swappable bays
1 x M.2 slot with SATA interface
2 x FHHL PCIe Gen5 x16 slots
1 x LP PCIe Gen5 x8 slot
48V DC Bus Bar power solution

* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2OU 2-Node
262.7 x 90 x 740

Open Rack Version

ORv3

Motherboard

MS13-HD0

CPU

5th Generation Intel^® Xeon^® Scalable Processors
4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series
Single processor, TDP up to 350W

Memory

8 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported

5th Gen Intel^® Xeon^®: Up to 5600 MT/s
4th Gen Intel^® Xeon^®: Up to 4800 MT/s
Intel^® Xeon^® Max Series: Up to 4800 MT/s

LAN

Front side:
1 x Dedicated Management LAN

Storage

Front side:
10 x 9.5mm E1.S NVMe hot-swappable bays

SAS

N/A

RAID

N/A

Expansion Slots

Riser Card CRSH02D:
- 2 x PCIe x16 (Gen5 x16) FHHL slots

Riser Card CRSH02E:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, occupied for E1.S support
- 1 x PCIe x16 (Gen5 x8) low-profile slot

1 x M.2 slot (CFPH010):
- M-key
- SATA, from PCH
- Supports 2242/2260/2280/22110 cards

Front I/O

1 x USB 3.2 Gen1 (Type-C)
1 x Mini-DP
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x System status LED
1 x ID LED

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

Supports up to 1600W

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022 (x64)

System Fans

N/A

Packaging Dimensions

N/A

Packaging Content

1 x TO25-S11-AA01
1 x CPU heatsink
3 x Carrier clips

Part Numbers

- Barebone package (5th/4th Gen): 6NTO25S11DR000AB01*
- Barebone package (4th Gen): 6NTO25S11DR000AA01*
- Motherboard: 9MS13HD0UR-000
- CPU heatsink: 25ST1-143102-C1R
- Front panel board - COFP111: 9COFP111NR-00
- Re-driver card - CORC211: 9CORC211NR-00
- Riser card - CRSH02D: 9CRSH02DNR-00
- Riser card - CRSH02E: 9CRSH02ENR-00
- EDSFF Base board - COBP721: 9COBP721NR-00
- EDSFF Base board - COBP740: 9COBP740NR-00
- EDSFF Bypass card - CSPP010: 9CSPP010NR-00
- I/O board with M.2 slot - CFPH010: 9CFPH010NR-00

No. of Bus Bars

1 x 48V Bus Bar

SUPPORT

下载

驱动程序
BIOS
工具程序
Firmware

使用手冊
支持列表

Online Support

驱动程序

BIOS

工具程序

Firmware

All
All
Windows Server 2022
Windows Server 2019
Linux

芯片组

版本

档案大小

日期

Intel^® Chipset Driver

Version : 10.1.19485.8386

3.81 MB

Jan 04, 2024

TO25-S11 (rev. AA01)

SPECIFICATIONS

SUPPORT

RESOURCES

TO25-S11 (rev. AA01)

TO25-S11
(rev. AA01)