SDM-1135G7L

Intel® Smart Display Module with Intel® 11th Generation Core™ i5-1135G7 Processor

Intel® Core™ i5-1135G7 Processor

Dual Channel DDR4, 2 x SO-DIMMs

1 x GbE LAN Port

3 x USB 3.2 Gen 1

1 x USB 2.0

Environment : Operation 0~55°C

Long life time support

Support 4K/60Hz, HDCP v2.2

(For more product information, please contact us at sales@gigaipc.com)

加入比较表

11th Generation Intel® Core™ Processors

Intel's blazing fast, feature packed processor family with built-in security is ready to take your productivity, and creativity to the next level. And, by enabling new exciting Windows 10 features, the 11th generation Intel Core processors empower you to unleash your imagination and explore the possibilities.
HDMI™-The Next Generation Multimedia Interface

HDMI™ is a High-Definition Multimedia Interface which provides up to 5Gb/s video transmitting bandwidth and 8-channel high quality audio all through a single cable. Able to transmit superior, uncompressed digital video and audio, HDMI™ ensures the crispest rendering of digital content up to 1080p without the quality losses associated with analog interfaces and their digital-to-analog conversion. In addition, HDMI™ is compatible with HDCP (High-bandwidth Digital Content Protection), allowing the playback of Blu-ray/HD DVD and other protected media content.
M.2 Onboard Connector

Providing users PCI-Express connectivity for SSD devices. Delivering up to 10 Gbps data transfer speeds, M.2 offers users considerably faster storage performance than current mSATA and even SATA Revision 3 6Gbps storage devices.
SuperSpeed USB 3.0

With superfast transfer rates of up to 5 Gbps, users are able to experience a theoretical 10x improvement over USB 2.0. Additionally, backwards compatibility with USB 2.0 assures users of long term use of their legacy USB 2.0 devices.

* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Board Size

SDM-Large
175W x 100D (mm)

Operating Properties

Operating temperature: 0°C to 55°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)

Processor Supported

Intel® Core™ i5-1135G7 Processor
10nm SuperFin, 4 cores, 8 threads, up to 4.20 GHz
TDP 28W

Socket

1 x FCBGA1449

Memory Type

2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB
Support Dual Channel DDR4 3200 MHz memory modules

Integrated Network

1 x GbE LAN Port (Intel® I219V)

Integrated Video Controller

Integrated Graphics Processor - Intel® Iris Xᵉ Graphics:
1 x HDMI 2.0 (SDM), supporting a maximum resolution of 4096x2160 @60Hz
1 x Display Port (SDM), supporting a maximum resolution of 4096x2160 @60Hz
2 x HDMI 2.0 (Rear), supporting a maximum resolution of 4096x2160 @60Hz

(4 independent display outputs)

Integrated Audio Controller

Intel® Integrated Audio

Expansion Slot

1 x 2280 M.2 M-Key (PCIe x4, SATA 6Gb/s)
1 x 2230 M.2 E-Key

Rear I/O Connectors

2 x HDMI
1 x RJ45 LAN Port
3 x USB 3.2 Gen 1
1 x USB 2.0
1 x PWR LED
1 x HDD LED
2 x External Antenna Holes (Optional)
1 x Reset button
1 x Power button

TPM

1 x TPM header

OS Driver Supported

Windows® 10 (x64)

Packaging Bundle

Carton size: 465 x 351 x 217 (mm)
Packing Capacity: 10pcs

Including:
Screw Kit with #0 ZIPLOCK BAG SCREW-BIND M3.0*L5.0 NI x 2pcs (P/N: 25KSD-130053-S0R)

Ordering Information

9MTGU5ALMR-SI (Box packing)