E152-ZE1

Edge Server – 1U short depth AMD EPYC™ 7003 series server system
  • Supports 1 x Dual slot or 2 x Single slot GPU cards
  • AMD EPYC™ 7003 series processors
  • Single processor, 7nm technology
  • 8-Channel RDIMM/LRDIMM DDR4 per processor, 8 x DIMMs
  • 2 x 1Gb/s LAN ports (Intel® I350-AM2)
  • 1 x Dedicated management port
  • 2 x 2.5" Gen4 NVMe/SATA hot-swappable bays
  • 2 x M.2 slots with PCIe Gen4 x4 interface
  • 2 x FHFL PCIe Gen4 x16 slots for GPUs
  • 1 x LP PCIe Gen4 x16 slot
  • 1 x OCP 3.0 Gen4 x16 slot
  • 1+1 1000W (240V) 80 PLUS Platinum redundant power supplies
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
1U
438 x 43.5 x 400
Motherboard
MZE2-G10
CPU
AMD EPYC™ 7003 series processors
Single processor, 7nm technology
Up to 64-core, 128 threads per processor
cTDP up to 240W

Compatible with AMD EPYC™ 7002 series processors
Socket
1 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
8 x DIMM slots
DDR4 memory supported only
8-Channel memory per processor architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200/2933 MHz
LAN
Front side:
2 x 1Gb/s LAN ports (Intel® I350-AM2)
Supports NCSI function

1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
Front side:
2 x 2.5" Gen4 NVMe/SATA hot-swappable bays

Supports 7mm drives only
SAS
N/A
RAID
N/A
Expansion Slots
1 x PCIe x16 (Gen4 x16) FHFL slot, for GPUs
1 x PCIe x16 (Gen4 x16) FHFL slot, for GPUs, occupied when Dual slot GPU is inserted
1 x PCIe x16 (Gen4 x16) low-profile slot

1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth
Supports NCSI function

2 x M.2 slots (CMTP182):
- M-key
- PCIe Gen4 x4
- Supports 2280/22110 cards
Internal I/O
2 x M.2 slots
1 x TPM header
1 x USB 3.0 connector
1 x Front Panel connector
1 x HDD BPB connector
1 x OCP 3.0 slot
Front I/O
2 x USB 3.0
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x System status LED
Rear I/O
N/A
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
1+1 1000W 80 PLUS Platinum redundant power supplies

AC Input:
- 100-127V~/ 15A, 50-60Hz
- 200-240V~/ 8A, 50-60Hz

DC Output:
- Max 1000W
+ 12V/ 83.3A
+ 12Vsb/ 3A
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage/Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP/AD/RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later
System Fans
1 x 40x40x28mm (25,000rpm)
5 x 40x40x56mm (25,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 7.7 kg
Gross Weight: 11.72 kg
Packaging Dimensions
628 x 549 x 200 mm
Packaging Content
1 x E152-ZE1
1 x CPU heatsink

*Rail kit not included. Please refer to optional parts for compatible rail kit.
Part Numbers
- Barebone package: 6NE152ZE1MR-00-A*
- Motherboard: 9MZE2G10NR-00
- CPU heatsink: 25ST1-453211-A3R
- Backplane board - CBPH022: 9CBPH022NR-00
- Fan module (40x40x28mm): 25ST2-442827-D0R
- Fan module (40x40x56mm): 25ST2-44562M-D0R
- Fan module (40x40x56mm): 25ST2-44562N-D0R
- M.2 riser card - CMTP182: 9CMTP182NR-00
- Riser card - CRSE020: 9CRSE020NR-00
- Riser card - CRSH01H: 9CRSH01HNR-00
- NVMe card - CNV3152: 9CNV3152NR-00
- Power supply: 25EP0-210000-D0S

Optional parts:

- 2-Section Rail kit (385-480mm): 25HB2-3A0204-K0R (MOQ: 500)
- 2-Section Rail kit (660-840mm): 25HB2-3A0203-K0R
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 64bit
BIOS
说明
版本
档案大小
日期
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手册
说明
版本
档案大小
日期

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