* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
1U
438 x 43.5 x 500
Motherboard
ME62-GE0
CPU
3rd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
10nm technology, CPU TDP up to 270W
Socket
1 x LGA 4189
Socket P+
Chipset
Intel® C621A Express Chipset
Memory
16 x DIMM slots
DDR4 memory supported only
8-channel memory architecture per processor
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
LAN
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Audio
N/A
Storage
2 x 2.5" SATA/SAS/Gen4 NVMe hot-swappable HDD/SSD bays

SAS card is required for SAS devices support
SAS
N/A
RAID
Intel® SATA RAID 0/1/10/5
Peripheral Drives
N/A
Expansion Slots
1 x Full-height Full-length PCIe Gen4 x16 expansion slot
2 x Low-Profile PCIe Gen4 x16 expansion slots
1 x OCP 3.0 Gen4 x16 mezzanine slot

2 x M.2 slots:
- M-key
- PCIe Gen4 x4 from CPU
- Supports NGFF-2280/22110 cards

1 x M.2 slot:
- M-key
- PCIe Gen3 x4 from C621A
- Supports NGFF-2280/22110 cards
Internal I/O
3 x M.2 slots
2 x SATA ports
1 x TPM header
Front I/O
2 x USB 3.0
1 x miniDP
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x System status LED
Rear I/O
N/A
Backplane I/O
Bandwidth: SATA 6Gb/s or SAS 12Gb/s per port or PCIe Gen4 x4
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
Redundant 800W 80 PLUS Platinum hot-swap power supply
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 8.2 ( x64) or later
Red Hat Enterprise Linux 8.3 ( x64) or later

SUSE Linux Enterprise Server 12 SP5 ( x64) or later
SUSE Linux Enterprise Server 15 SP2 ( x64) or later

Ubuntu 20.04 LTS (x64) or later
Ubuntu 20.04.1 LTS (x64) or later

VMware ESXi 6.7 Update3 P03
VMware ESXi 7.0 Update2
System Fans
6 x 40x40x56mm (29,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
786 x 588 x 250 (mm)
Packaging Content
1 x E162-220
1 x CPU heatsinks
1 x Rail kit (in option)
Part Numbers
Barebone package: 6NE162220MR-00
Part Numbers:
- Motherboard: 9ME62GE0NR-00
- CPU heatsink: 25ST1-453213-M1R
- Back plane board: 9CBPE020NR-00
- Power supply: 25EP0-208007-F3S
- Riser card - CRSE010: 9CRSE010NR-00
- Riser card - CRSE011: 9CRSE011NR-00
- Riser card - CRSE012: 9CRSE012NR-00
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

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