* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 4 Nodes - Rear access
440 x 87.5 x 475
Motherboard
MZ12-HD0 Rev. 3.0
CPU
AMD EPYC™ 7003 series processor family
Single processor, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 225W, cTDP up to 240W

Conditional support 280W

Compatible with AMD EPYC™ 7002 series processor family
Socket
Per Node:
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
8 x DIMM slots

Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Audio
N/A
Storage
Per node:
1 x 2.5" NVMe hot-swappable SSD bays

Total:
4 x 2.5" NVMe hot-swappable SSD bays

All storage bays are compatible with SATA devices
SAS
N/A
RAID
N/A
Peripheral Drives
N/A
Expansion Slots
Per node:
1 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
1 x Low profile half-length slots with PCIe x16 (Gen3 x16 bus)
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)

2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

Total:
4 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
4 x Low profile half-length slots with PCIe x16 (Gen3 x16 bus)
4 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)

8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Internal I/O
Per node:
2 x M.2 slot
1 x USB 3.0 header
1 x TPM header
1 x OCP 2.0 mezzanine slots
1 x Front panel header
1 x Back plane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
Backplane I/O
4 x ports
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s or PCIe Gen3 x4 per port
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
2 x 1200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-240V~/ 12-7A, 50-60Hz
DC Input:
- 240Vdc/ 6A

DC Output:
- Max 1000W/ 100-240V~
+12V/ 80.5A
+12Vsb/ 3A
- Max 1200W/ 200-240V~ or 240Vdc input
+12V/ 97A
+12Vsb/ 3A
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Windows Server 2016 ( X2APIC/256T not supported)
Windows Server 2019

Red Hat Enterprise Linux 8.3 ( x64) or later

SUSE Linux Enterprise Server 12 SP5 ( x64) or later
SUSE Linux Enterprise Server 15 SP2 ( x64) or later

Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later

Citrix Hypervisor 8.2.0 or later
System Fans
3 x 80x80x38mm (16,300rpm)
1 x 40x40x28mm (25,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Ambient temperature limited to 30°C if using 280W CPU
Packaging Dimensions
857 x 670 x 280 mm
Packaging Content
1 x H242-Z10
4 x CPU heatsinks
1 x Rail Kit
Part Numbers
Barebone package: 6NH242Z10MR-00 Rev. A00
Spare parts:
- Motherboard: 9MZ12HD0NR-00
- Back plane board: 9CBPH043NR-00
- Rail kit: 25HB2-AA6107-K0R
- CPU heatsink: 25ST1-44320J-A0R
- M.2 extension card: 9CMTP051NR-00 ( in option)
- Back plane board: 9CBPH043NR-00
- Fan module: 25ST2-44282D-D0R/ 25ST2-88382E-D0R
- CMC Kit: 6NH242Z12SR-00
- M.2 Heatsink kit: 6NH242Z17SR-00-100 (in option)
- Power Supply: 25EP0-212007-F3S
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • Choose your OS
  • Choose your OS
  • Windows Server 2019
  • Windows Server 2016 64bit
芯片组
芯片组
版本
档案大小
日期
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • Choose your OS
  • Choose your OS
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.50
110.55 MB
2021/03/06
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019
使用手冊
说明
版本
档案大小
日期

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