G241-G40

HPC/AI Server - 1st/2nd Gen Intel® Xeon® Scalable - 2U DP 4 x PCIe Gen3 GPUs
  • Supports up to 4 x Dual slot Gen3 GPUs
  • NVIDIA® validated GPU platform; Supports for NVIDIA® Tesla® GPUs
  • NVIDIA® NGC™ Ready server
  • 1st/2nd Gen Intel® Xeon® Scalable Processors
  • Dual processor, LGA 3647
  • 6-Channel RDIMM/LRDIMM DDR4, 12 x DIMMs
  • 2 x 10Gb/s LAN ports via Intel® X557-AT2
  • 2 x 1Gb/s LAN ports via Marvell® 88E1514
  • 1 x Dedicated management port
  • 4 x 3.5"/2.5" SATA hot-swappable bays
  • 2 x SATA DOM supported
  • 2 x M.2 slots with PCIe Gen3 x4 interface
  • 4 x FHFL PCIe Gen3 x16 slots for GPUs
  • 3 x LP PCIe Gen3 x16 and x8 slots for add-in cards
  • Aspeed® AST2500 remote management controller
  • Dual 2000W 80 PLUS Platinum redundant power supply
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U
438 x 87.5 x 820
Motherboard
MD71-HB1
CPU
2nd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Scalable Processors
Dual processor, TDP up to 165W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 3647
Socket P
Chipset
Intel® C622 Chipset
Memory
12 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
1.2V modules: 2933/2666/2400 MT/s

Note: 2933MHz memory is supported only with 2nd Generation Intel® Xeon® Scalable Processors.
LAN
Rear side:
2 x 10Gb/s BASE-T LAN ports (1 x Intel® X557-AT2)
NCSI function supported

2 x 1Gb/s LAN ports
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Front side:
4 x 3.5"/2.5" SATA hot-swappable bays

SATA devices supported only

2 x SATA DOM supported
SATA
Supported
SAS
N/A
RAID
Intel® SATA RAID 0/1/10/5
Expansion Slots
4 x PCIe x16 (Gen3 x16) FHFL slots, for GPUs ( Slot_1 / Slot_3 / Slot_5 / Slot_7)
Pre-installed CRSG02A in each slot

Slot_2: 1 x PCIe x8 (Gen3 x8) low-profile slot, from CPU_0, shared with M.2 PCIe Gen3 x4 slot
Slot_4: 1 x PCIe x8 (Gen3 x8) low-profile slot, from CPU_1, shared with slot_5 Slot_6: 1 x PCIe x16 (Gen3 x16) slot, from CPU_1

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 22110/2280 cards

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from PCH
- Supports 22110/2280 cards

- System is validated for population with a uniform GPU model
- Support is not provided for mixed GPU populations
Internal I/O
1 x TPM header
1 x Front panel header
Front I/O
1 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x NMI button
1 x System status LED
1 x Storage activity LED
2 x LAN activity LEDs
Rear I/O
2 x USB 3.0
1 x VGA
4 x RJ45
1 x MLAN
1 x ID button with LED
Backplane Board
Speed and bandwidth:
SATA 6Gb/s
TPM
1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Power Supply
Dual 2000W 80 PLUS Platinum redundant power supply

AC Input:
- 100-120V~/ 12A, 50/60Hz
- 180-240V~/ 10A, 50/60Hz

DC Input: (Only for China)
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-120V~
+12.2V/ 81.5A
+12Vsb/ 2.5A
- Max 1600W/ 180-199V~
+12.2V/ 131A
+12Vsb/ 2.5A
- Max 1800W/ 200-220V~
+12.2V/ 147.5A
+12Vsb/ 2.5A
- Max 2000W/ 221-240V~ or 240Vdc Input
+12.2V/ 163.5A
+12Vsb/ 2.5A
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
For Skylake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
System Fans
5 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Note: Please contact Technical Support for more information about optimized GPU system operating temperature.
Weight
Net Weight: 25 kg
Gross Weight: 29.96 kg
Packaging Dimensions
1077 x 679 x 300 mm
Packaging Content
1 x G241-G40
2 x CPU heatsinks
1 x 2-Section Rail kit
2 x Non-fabric CPU carriers
Part Numbers
- Barebone package: 6NG241G40MR-00-1*
- Motherboard: 9MD71HB1NR-00
- 2-Section Rail kit: 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-253106-F2R/25ST1-253209-F2R
- Non-fabric CPU carrier: 12KRC-0F3647-50R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - CBPG041: 9CBPG041NR-00
- System PDB: 9CPDGDSANR-00
- Fan module: 25ST2-88382A-D0R
- Power supply: 25EP0-22000A-L0S
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • All
  • All
  • Windows Server 2019
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Linux
芯片组
芯片组
版本
档案大小
日期
网卡
网卡
版本
档案大小
日期
SATA RAID/AHCI
SATA RAID/AHCI
版本
档案大小
日期
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 6.0.0.1357
6.54 MB
Apr 19, 2019
操作系统: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 6.0.0.1357
265.09 MB
Apr 21, 2019
操作系统: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.76
147.87 MB
May 22, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手冊
说明
版本
档案大小
日期

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