G363-SR0
(rev. AAX1)
HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 3U DP HGX™ H100 4-GPU
- NVIDIA-Certified System - Data Center Server
- NVIDIA HGX™ H100 with 4 x SXM5 GPUs
- 4th-generation NVLink® 900GB/s
- Dual 5th/4th Gen Intel® Xeon® Scalable Processors
- Dual Intel® Xeon® CPU Max Series
- 8-Channel RDIMM DDR5, 16 x DIMMs
- Dual ROM Architecture
- 2 x 10Gb/s BASE-T LAN ports via Broadcom® BCM57416
- 2 x 1Gb/s LAN ports via Intel® I350-AM2
- 8 x 2.5" Gen5 NVMe/SATA/SAS hot-swappable bays
- 1 x M.2 slot with PCIe Gen4 x4 interface
- 6 x LP PCIe Gen5 x16 slots
- 2+1 3000W 80 PLUS Titanium redundant power supplies
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
3U
448 x 130 x 800
448 x 130 x 800
Motherboard
MS63-HD2
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Dual processor, TDP up to 350W
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4677
Socket E
Socket E
Chipset
Intel® C741
Memory
16 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s
Intel® Xeon® Max Series: Up to 4800 MT/s
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s
Intel® Xeon® Max Series: Up to 4800 MT/s
LAN
Front side:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function (by switch setting)
1 x 10/100/1000 Mbps Management LAN
Rear side:
2 x 10Gb/s BASE-T LAN ports (1 x Broadcom® BCM57416)
Support NCSI function (by switch setting)
1 x 10/100/1000 Mbps Management LAN
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function (by switch setting)
1 x 10/100/1000 Mbps Management LAN
Rear side:
2 x 10Gb/s BASE-T LAN ports (1 x Broadcom® BCM57416)
Support NCSI function (by switch setting)
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Storage
Front side:
8 x 2.5" Gen5 NVMe/SATA/SAS hot-swappable bays, NVMe from PEX89144
SAS card is required for SAS devices support
8 x 2.5" Gen5 NVMe/SATA/SAS hot-swappable bays, NVMe from PEX89144
SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
Intel® SATA RAID 0/1/10/5
Expansion Slots
NVIDIA HGX™ H100 with 4 x SXM5 GPUs
Front side:
Riser Card CRSH01R:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
PCIe Cable:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1
Rear side:
4 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89144, support RDMA
(Equipped with full-height brackets)
1 x OCP 3.0 slot on the front side, disabled, from CPU_0
1 x M.2 slot (CMTP192):
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Front side:
Riser Card CRSH01R:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
PCIe Cable:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1
Rear side:
4 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89144, support RDMA
(Equipped with full-height brackets)
1 x OCP 3.0 slot on the front side, disabled, from CPU_0
1 x M.2 slot (CMTP192):
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Internal I/O
1 x TPM header
1 x VROC connector
1 x VROC connector
Front I/O
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45 (Intel I350)
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED
1 x Mini-DP
2 x RJ45 (Intel I350)
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
2 x RJ45 (Broadcom BCM57416)
1 x MLAN (optional)
1 x MLAN (optional)
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen5 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
2+1 3000W 80 PLUS Titanium redundant power supplies
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Windows Server 2022 (x64)
Additional certifications:
Windows Server 2022 (x64)
System Fans
7 x 80x80x80mm (17,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 34.2 kg
Gross Weight: 70.8 kg
Gross Weight: 70.8 kg
Packaging Dimensions
1176 x 782 x 295 mm
Packaging Content
1 x G363-SR0-AAX1
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
6 x Carrier clips
1 x L-shape Rail kit
2 x CPU heatsinks
1 x Mini-DP to D-Sub cable
6 x Carrier clips
1 x L-shape Rail kit
Part Numbers
- Barebone w/ Nvidia module (5th/4th Gen): 6NG363SR0DR000ABX1*
- Barebone w/ Nvidia module (4th Gen): 6NG363SR0DR000AAX1*
- Barebone w/ Nvidia module (RoT): 6NG363SR0MR000ABX1*/AAX1*
- Motherboard: 9MS63HD2UR-000
- L-shape Rail kit: 25HB2-A86102-K0R
- CPU heatsink: 25ST1-353401-M1R
- GPU heatsink: 25ST1-3332G0-F2R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - CBP2081: 9CBP2081NR-00
- Fan module: 25ST2-808035-S1R
- Fan module: 25ST2-888030-S1R
- Fan module: 25ST2-888031-S1R
- M.2 expansion card - CMTP192: 9CMTP192NR-00
- Riser card - CRSH01R: 9CRSH01RNR-00
- OCP card - CNVC171: 9CNVC171NR-00
- Front I/O board (incl. I350-AM2) - CLBH160: 9CLBH160NR-00
- Rear I/O board (incl. MLAN chip) - CDB66: 9CLBH160NR-00
- PCIe switch board - CPBG901: 9CPBG901NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000A-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NG363SR0SR-RMA-A100
- Barebone w/ Nvidia module (4th Gen): 6NG363SR0DR000AAX1*
- Barebone w/ Nvidia module (RoT): 6NG363SR0MR000ABX1*/AAX1*
- Motherboard: 9MS63HD2UR-000
- L-shape Rail kit: 25HB2-A86102-K0R
- CPU heatsink: 25ST1-353401-M1R
- GPU heatsink: 25ST1-3332G0-F2R
- Front panel board - CFP1000: 9CFP1000NR-00
- Backplane board - CBP2081: 9CBP2081NR-00
- Fan module: 25ST2-808035-S1R
- Fan module: 25ST2-888030-S1R
- Fan module: 25ST2-888031-S1R
- M.2 expansion card - CMTP192: 9CMTP192NR-00
- Riser card - CRSH01R: 9CRSH01RNR-00
- OCP card - CNVC171: 9CNVC171NR-00
- Front I/O board (incl. I350-AM2) - CLBH160: 9CLBH160NR-00
- Rear I/O board (incl. MLAN chip) - CDB66: 9CLBH160NR-00
- PCIe switch board - CPBG901: 9CPBG901NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000A-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NG363SR0SR-RMA-A100
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SUPPORT
驱动程序
BIOS
工具程序
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
芯片组
芯片组
版本
档案大小
日期
Intel® Chipset Driver
Version : 10.1.19485.8386
3.81 MB
Jan 04, 2024
操作系统: Windows Server 2019,Windows Server 2022
网卡
RAID
RAID
版本
档案大小
日期
Intel® VROC
Intel® SATA RAID and Utility
Intel® SATA RAID and Utility
Version : 8.5.0.1593
99.21 MB
Jan 04, 2024
操作系统: Windows Server 2019,Windows Server 2022
公用程式
BIOS
说明
版本
档案大小
日期
Include INTEL-TA-01036 (CVE-2023-45745/CVE-2023-47855); AMI SA50232 (CVE-2023-45236/CVE-2023-45237), and multiple feature updates.
Version : R06
29.48 MB
Apr 12, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
注意:
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.74
147.86 MB
Mar 05, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
说明
版本
档案大小
日期
BMC firmware with embedded GIGABYTE Management Console
(AST2600)
(AST2600)
Version : 13.05.09
113.83 MB
Jan 26, 2024
英语
使用手冊
说明
版本
档案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
17.39 MB
Aug 29, 2023
英语
说明
版本
档案大小
日期
操作系统支持列表
Version : 1.5
0.22 MB
Jan 04, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
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