H223-Z10
(rev. AAP1)

High Density Server - AMD EPYC™ 9004 - 2U 3-Node UP 6-Bay E1.S Gen4 NVMe
  • 2U 3-node front access server system
  • AMD EPYC™ 9004 Series processors
  • AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
  • Single processor per node, 5nm technology
  • 12-Channel RDIMM DDR5 per processor, 36 x DIMMs
  • Dual ROM Architecture
  • 2 x CMC ports
  • 6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
  • 3 x FHHL PCIe Gen5 x16 slots
  • 3 x LP PCIe Gen5 x16 slots
  • 3 x OCP 3.0 Gen5 x16 slots
  • 1+1 3000W 80 PLUS Titanium redundant power supplies
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 3-Node - Front access
447.8 x 87.5 x 500
Motherboard
MZ13-HD0
CPU
AMD EPYC™ 9004 Series processors
AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
*Up to 128-core, 256 threads per processor
cTDP up to 240W at ambient 35°C

cTDP up to 300W at ambient 30°C

*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.
Socket
Per Node:
1 x LGA 6096

Total:
3 x LGA 6096

Socket SP5
Chipset
System on Chip
Memory
Per node:
12 x DIMM slots

Total:
36 x DIMM slots

DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
LAN
Total:
2 x CMC ports
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

Total:
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
Riser Card CRSH01Q:
- 1 x PCIe x16 (Gen5 x16) low-profile slot

Riser Card CRSH01R:
- 1 x PCIe x16 (Gen5 x16) FHHL slot

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth
Supports NCSI function

Optional 1 x M.2 slot (CMTP192):
- M-key
- PCIe Gen4 x4
- Supports 2280/22110 cards

Total:
Riser Card CRSH01Q x 3:
- 3 x PCIe x16 (Gen5 x16) low-profile slots

Riser Card CRSH01R x 3:
- 3 x PCIe x16 (Gen5 x16) FHHL slots

3 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth
Support NCSI function

Optional 3 x M.2 slots (CMTP192):
- M-key
- PCIe Gen4 x4
- Support 2280/22110 cards
Internal I/O
Per node:
1 x TPM header
Front I/O
Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x Power button with LED
1 x ID LED
1 x System status LED

Total:
6 x USB 3.2 Gen1
3 x VGA
3 x Power buttons with LED
3 x ID LEDs
3 x System status LEDs
2 x CMC ports
1 x CMC status LED
Rear I/O
N/A
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
1+1 3000W 80 PLUS Titanium redundant power supplies

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input:
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+ 12.2V/ 81A
+ 12Vsb/ 3A
- Max 2600W/ 200-220V~
+ 12.2V/ 213A
+ 12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+ 12.2V/ 245A
+ 12Vsb/ 3A

Note: The system power supply requires C19 power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS / BMC / CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 17.4 kg
Gross Weight: 28.4 kg
Packaging Dimensions
857 x 670 x 280 mm
Packaging Content
1 x H223-Z10
3 x CPU heatsinks
1 x L-shape Rail kit
Part Numbers
- Barebone package: 6NH223Z10DR000AAP1*
- Motherboard: 9MZ13HD0UR-000
- L-shape Rail kit: 25HB2-A86105-K0R
- CPU heatsink: 25ST1-553202-A0R
- Front panel board - CFPH030: 9CFPH030NR-00
- Backplane board - CBP2060: 9CBP2060NR-00
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00
- Riser card - CRSH01R: 9CRSH01RNR-00
- EDSFF Riser card - CSPP010: 9CSPP010NR-00
- LAN bridge board - CLSH13: 9CLSH13NR-00
- Power Supply: 25EP0-23000F-G1S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP192: 9CMTP192NR-00
- RMA packaging: 6NH223Z10SR-RMA-A100
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
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GSM CLI
Version : 2.1.72
147.86 MB
Mar 05, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
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