H231-G20

High Density Server - 1st/2nd Gen Intel® Xeon® Scalable - 2U 2-Node DP 2 x PCIe Gen3 GPUs
  • Supports up to 2 x Dual slot Gen3 GPUs
  • NVIDIA® validated GPU platform; Supports for NVIDIA® Tesla® GPUs
  • 2U 2-node rear access server system
  • 1st/2nd Gen Intel® Xeon® Scalable Processors
  • Dual processor per node, LGA 3647
  • Intel® C621 Chipset
  • 6-Channel RDIMM/LRDIMM DDR4, 32 x DIMMs
  • Supports Intel® Optane™ DC Persistent Memory
  • 4 x 10Gb/s BASE-T LAN ports via Intel® X550-AT2
  • 2 x Dedicated management ports
  • 1 x CMC port
  • 4 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
  • 20 x 2.5" SATA/SAS hot-swappable bays
  • 2 x LP PCIe Gen3 x16 slots
  • 2 x LP PCIe Gen3 x8 slots
  • 2 x OCP Gen3 x16 mezzanine slots
  • Aspeed® AST2500 remote management controller
  • Dual 2200W 80 PLUS Platinum redundant power supply
  • Optimized performance with Mellanox Infiniband EDR 100G or Ethernet 100G products
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 2-Node - Rear access
440 x 87 x 820
Motherboard
MH61-HD3
CPU
2nd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 165W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
Per Node:
2 x LGA 3647

Total:
4 x LGA 3647

Socket P
Chipset
Intel® C621 Chipset
Memory
Per node:
16 x DIMM slots

Total:
32 x DIMM slots

DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MT/s

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)

DCPMM installation locations:
DIMM_P1_(G1, J1)

Note:
1. 2933MT/s memory is supported only with 2nd Generation Intel® Xeon® Scalable Processors.
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only.
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C.
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative.
LAN
Per node:
2 x 10Gb/s BASE-T LAN ports (Intel® X550-AT2)
NCSI function supported (by switch)

1 x Dedicated management port

Total:
4 x 10Gb/s BASE-T LAN ports (Intel® X550-AT2)
NCSI function supported (by switch)

2 x Dedicated management ports
1 x 10/100/1000 Mbps CMC port

*Omni-Path is supported in option.
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Management chip in CMC board:
Integrated in Aspeed® AST1250
Storage
Per node:
2 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
10 x 2.5" SATA/SAS hot-swappable bays

1 x Broadcom SAS35x24R expander

Default configuration supports:

2 x U.2 and 0 x SAS/SATA drives
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)

Total:
4 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
20 x 2.5" SATA/SAS hot-swappable bays

2 x Broadcom SAS35x24R expander

Default configuration supports:

4 x U.2 and 0 x SAS/SATA drives

SAS card is required to enable the drive bays
RAID
For SATA drives:
Intel® SATA RAID 0/1/5/10

For U.2 drives:
Intel® Virtual RAID On CPU (VROC) RAID 0/1

Note: VROC module is for Intel® SSD only.
Expansion Slots
Per node:
1 x PCIe x16 (Gen3 x16) FHFL slot, for GPUs
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x PCIe x8 (Gen3 x8) low-profile slot

1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth

Total:
2 x PCIe x16 (Gen3 x16) FHFL slots, for GPUs
2 x PCIe x16 (Gen3 x16) low-profile slots
2 x PCIe x8 (Gen3 x8) low-profile slots

2 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth

Note: For the latest GPU QVL, please contact your GIGABYTE representative.
Internal I/O
Per node:
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED

Total:
2 x Power buttons with LED
2 x ID buttons with LED
2 x Status LEDs
*1 x CMC status LED

*Only one CMC status LED per system.
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
4 x USB 3.0
2 x VGA
4 x RJ45
2 x MLAN
2 x ID LEDs
*1 x CMC port

*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input: (Only for China)
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A

Note:
1) The system power supply requires C19 power cord.
2) 2000W 80 PLUS Titanium power supply as an option.
System Management
Aspeed® AST2500 management controller
Avocent® MergePoint IPMI 2.0 web interface:
  • Network settings
  • Network security settings
  • Hardware information
  • Users control
  • Services settings
  • IPMI settings
  • Sessions control
  • LDAP settings
  • Power control
  • Fan profiles
  • Voltages, fans and temperatures monitoring
  • System event log
  • Events management (platform events, trap settings, email settings)
  • Serial Over LAN
  • vKVM & vMedia (HTML5)
OS Compatibility
For Skylake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 or later
Red Hat Enterprise Linux 7.3 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 11 SP4 or later
SUSE Linux Enterprise Server 12 SP2 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 16.04.1 LTS or later
Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP3 or later
SUSE Linux Enterprise Server 15 or later

Ubuntu 18.04 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Note: Please contact Technical Support for more information about optimized GPU system operating temperature.
Weight
30 kg (full packaging)
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H231-G20
4 x CPU heatsinks
1 x Rail Kit
1 x VROC module
4 x Non-Fabric CPU carriers
Part Numbers
- Barebone package: 6NH231G20MR-00*
- Motherboard: 9MH61HD3NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-253203-F2R/25ST1-253204-F2R
- Backplane board - CBPH0O0: 9CBPH0O0NR-NJ
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222001-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH23NR48SR-00
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • All
  • All
  • Windows Server 2019
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Linux
芯片组
芯片组
版本
档案大小
日期
网卡
网卡
版本
档案大小
日期
SATA RAID/AHCI
SATA RAID/AHCI
版本
档案大小
日期
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 6.0.0.1357
6.54 MB
Apr 19, 2019
操作系统: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 6.0.0.1357
265.09 MB
Apr 21, 2019
操作系统: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.76
147.87 MB
May 22, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手冊
说明
版本
档案大小
日期

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