H252-3C0
(rev. 100)

HCI Server - 3rd Gen Intel^® Xeon^® Scalable - 2U 4-Node UP 12-Bay SATA/SAS

2U 4-node rear access server system
3rd Gen Intel^® Xeon^® Scalable Processors
Single processor per node, 10nm technology
8-Channel RDIMM/LRDIMM DDR4 per processor, 32 x DIMMs
Supports Intel^® Optane™ Persistent Memory 200 series
Dual ROM Architecture
Intel^® C621A Chipset
8 x 1Gb/s LAN ports (Intel^® I350-AM2)
4 x Dedicated management ports
1 x CMC port
12 x 3.5"/2.5" SATA/SAS hot-swappable bays
8 x LP PCIe Gen4 x16 slots
4 x OCP 2.0 Gen3 x8 mezzanine slots
Dual 1600W 80 PLUS Platinum redundant power supply

加入比较表

* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 695

Motherboard

MH12-HD0

CPU

3rd Generation Intel^® Xeon^® Scalable Processors
Single processor per node, 10nm technology
CPU TDP up to 270W

Socket

Per Node:
1 x LGA 4189

Total:
4 x LGA 4189

Socket P+

Chipset

Intel^® C621A Chipset

Memory

Per node:
8 x DIMM slots

Total:
32 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz

LAN

Per node:
2 x 1GbE LAN ports (1 x Intel^® I350-AM2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 1GbE LAN ports (4 x Intel^® I350-AM2)
Support NCSI function

4 x Dedicated management ports
1 x CMC port

Video

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Storage

Per node:
3 x 3.5"/2.5" SATA/SAS hot-swappable bays

Total:
12 x 3.5"/2.5" SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

SAS

Depends on SAS add-on card

RAID

Intel^® SATA RAID 0/1/5

Expansion Slots

Per node:
2 x PCIe x16 (Gen4 x16) low-profile slots
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth (Type1, P1, P2 with NCSI supported)

Total:
8 x PCIe x16 (Gen4 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth (Type1, P1, P2 with NCSI supported)

Internal I/O

Per node:
1 x USB 3.0 header
1 x SATA DOM
1 x TPM header
1 x OCP 2.0 mezzanine slots
1 x Front panel header
1 x Back plane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power buttons with LED
4 x ID button with LED
4 x Status LED
4 x Reset buttons
1 x CMC status LED
1 x CMC Reset button

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system

Backplane Board

Speed and bandwidth:
SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

Dual 1600W 80 PLUS Platinum redundant power supply

AC Input:
- 100-120V~/ 12A, 50-60Hz
- 200-240V~/ 10.0A, 50-60Hz

DC Input:
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-120V~
+ 12V/ 81.5A
+ 12Vsb/ 2.5A
- Max 1600W/ 200-240V~ or 240Vdc Input
+ 12V/ 133A
+ 12Vsb/ 2.5A

System Management

Aspeed^® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Windows Server 2016
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later

System Fans

4 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 22.2 kg
Gross Weight: 37.22 kg

Packaging Dimensions

1167 x 700 x 309 mm

Packaging Content

1 x H252-3C0
4 x CPU heatsinks
1 x 3-Section Rail kit

Part Numbers

- Barebone package: 6NH2523C0MR-00-1*
- Motherboard: 9MH12HD0NR-00
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-453213-M1R
- Backplane board - CBPH0C3: 9CBPH0C3NR-00
- Fan module: 25ST2-883828-D0R
- CMC Lan card - CLBH020: 9CLBH020NR-00
- Riser card - CRSH01D: 9CRSH01DNR-00
- Riser card - CRSH01E: 9CRSH01ENR-00
- Power Supply: 25EP0-216008-L0S

Optional parts:

- Ring topology kit: 6NH23NR48SR-00
- RMA packaging: 6NH2523C0SR-RMA-A100

SUPPORT

下载

驱动程序
BIOS
工具程序
Firmware

使用手冊
支持列表

Online Support

驱动程序

BIOS

工具程序

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Windows Server 2016 64bit
Linux

芯片组

版本

档案大小

日期

Intel^® Chipset Driver

Version : 10.1.18612.8252

3.08 MB

Jun 10, 2021

H252-3C0 (rev. 100)

SPECIFICATIONS

SUPPORT

RESOURCES

H252-3C0 (rev. 100)

H252-3C0
(rev. 100)