H262-NO0
(rev. 100)
- 2U 4-node rear access server system
- 3rd Gen Intel® Xeon® Scalable Processors
- Dual processor per node, 10nm technology
- 8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
- Supports Intel® Optane™ Persistent Memory 200 series
- Dual ROM Architecture
- Intel® C621A Chipset
- 8 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
- 4 x Dedicated management ports
- 1 x CMC port
- 24 x 2.5" Gen4 NVMe/SATA hot-swappable bays
- 8 x LP PCIe Gen4 x16 slots
- 4 x OCP 2.0 Gen3 x16 mezzanine slots
- 2200W 80 PLUS Platinum redundant power supply
1/6
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
440 x 87.5 x 840
Motherboard
MH62-HD1
CPU
3rd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
Dual processor per node, 10nm technology
CPU TDP up to 270W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
Dual processor per node, 10nm technology
CPU TDP up to 270W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
Per Node:
2 x LGA 4189
Total:
8 x LGA 4189
Socket P+
2 x LGA 4189
Total:
8 x LGA 4189
Socket P+
Chipset
Intel® C621A Chipset
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
LAN
Per node:
2 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2)
1 x Dedicated management port
Total:
8 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2)
4 x Dedicated management port
1 x CMC port
2 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2)
1 x Dedicated management port
Total:
8 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2)
4 x Dedicated management port
1 x CMC port
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
6 x Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
1 x SATA DOM
Total:
24 x Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
4 x SATA DOMs
SAS card is required for SAS devices support
6 x Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
1 x SATA DOM
Total:
24 x Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
4 x SATA DOMs
SAS card is required for SAS devices support
SAS
Depends on SAS Add-on card
RAID
Intel® SATA RAID 0/1/5/10
Expansion Slots
Per node:
Riser Card CRSH01D:
- 1 x PCIe x16 (Gen4 x16) low-profile slot
Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth*
Total:
Riser Card CRSH01D x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots
Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth*
*OCP 2.0 bandwidth is shared with onboard LAN. Onboard LAN would be disabled if OCP 2.0 utilizes Gen3 x16 bandwidth.
Riser Card CRSH01D:
- 1 x PCIe x16 (Gen4 x16) low-profile slot
Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth*
Total:
Riser Card CRSH01D x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots
Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth*
*OCP 2.0 bandwidth is shared with onboard LAN. Onboard LAN would be disabled if OCP 2.0 utilizes Gen3 x16 bandwidth.
Internal I/O
Per node:
1 x COM header
1 x SATA 7-pin connectors
1 x TPM header
1 x VROC connector
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x COM header
1 x SATA 7-pin connectors
1 x TPM header
1 x VROC connector
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button
*1 x CMC Status LED
*1 x CMC Reset button
*Only one CMC Status LED and Reset button per system
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button
*1 x CMC Status LED
*1 x CMC Reset button
*Only one CMC Status LED and Reset button per system
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system
Backplane I/O
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
2 x 2200W 80 PLUS Platinum redundant power supplies
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input:
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: The system power supply requires C19 power cord
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: The system power supply requires C19 power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP/AD/RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2016
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Please leave one PCIe slot empty if using processor with 270W TDP
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Please leave one PCIe slot empty if using processor with 270W TDP
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H262-NO0
8 x CPU heatsinks
1 x Rail Kit
8 x CPU heatsinks
1 x Rail Kit
Part Numbers
- Barebone package: 6NH262NO0MR-00-1*
- Motherboard: 9MH62HD1NR-00
- VROC module: 25FD0-R181N0-10R
(Supported for Intel SSD only, optional)
- Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-453212-M1R/25ST1-453213-M1R
- M.2 extension card: 9CMTP16ZNR-00 (optional)
- Backplane board - CBPH7O0: 9CBPH7O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- Ring topology kit: 6NH262Z65SR-00-100 (optional)
- Motherboard: 9MH62HD1NR-00
- VROC module: 25FD0-R181N0-10R
(Supported for Intel SSD only, optional)
- Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-453212-M1R/25ST1-453213-M1R
- M.2 extension card: 9CMTP16ZNR-00 (optional)
- Backplane board - CBPH7O0: 9CBPH7O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- Ring topology kit: 6NH262Z65SR-00-100 (optional)
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SUPPORT
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
- Linux
芯片组
网卡
网卡
版本
档案大小
日期
Intel® LAN Driver and Utility
Version : 26.2
678.06 MB
Jun 10, 2021
操作系统: Windows Server 2016 64bit,Windows Server 2019
Intel® LAN Driver and Utility
Version : 27.0
714.97 MB
Apr 21, 2022
操作系统: Windows Server 2022
SATA RAID/AHCI
SATA RAID/AHCI
版本
档案大小
日期
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 7.5.0.1991
4.17 MB
Sep 08, 2021
操作系统: Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 7.5.0.1991
23.93 MB
Sep 08, 2021
操作系统: Windows Server 2016 64bit,Windows Server 2019
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 7.7.0.1273
7.07 MB
Apr 25, 2022
操作系统: Windows Server 2022
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 7.7.0.1273
23.58 MB
Apr 25, 2022
操作系统: Windows Server 2022
BIOS
说明
版本
档案大小
日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
注意:
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.64
111.38 MB
Sep 05, 2023
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
说明
版本
档案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2600 AMI)
(AST2600 AMI)
Version : 13.05.07
112.97 MB
Sep 27, 2023
英语
BMC Firmware (AST2520) for CMC module
NOTE: Please make sure 2U-4Node system CMC firmware version is 12.40.19 or later before updating BMC firmware
NOTE: Please make sure 2U-4Node system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.25
81.64 MB
Aug 25, 2023
英语
使用手冊
说明
版本
档案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
17.39 MB
Aug 29, 2023
英语
支持列表
说明
版本
档案大小
日期
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