H262-NO0 (rev. 100)

HCI Server – Intel DP 2U 4 Nodes Server - 24 x Gen4 NVMe | Application: 超融合服务器 & 混合/私有云服务器

Application:

超融合服务器混合/私有云服务器

2U - 4 nodes rear access server system
3rd Gen. Intel^® Xeon^® Scalable Processors
8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
Supports Intel^® Optane™ Persistent Memory 200 series
Dual ROM Architecture supported
Intel^® C621A Chipset
8 x 10Gb/s BASE-T LAN ports (Intel^® X710-AT2)
4 x Dedicated management ports
1 x CMC global management port
24 x 2.5" SATA/SAS/Gen4 NVMe hot-swappable HDD/SSD bays
8 x Low profile PCIe Gen4 expansion slots
4 x OCP 2.0 Gen3 x16 mezzanine slots
2200W 80 PLUS Platinum redundant PSU

加入比较表

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* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4 Nodes - Rear access
440 x 87.5 x 840

Motherboard

MH62-HD1

CPU

3rd Generation Intel^® Xeon^® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
10nm technology, CPU TDP up to 270W

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Socket

Per Node:
2 x LGA 4189
Total:
8 x LGA 4189
Socket P+

Chipset

Intel^® C621A Express Chipset

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz

LAN

Per node:
2 x 10GbE BASE-T LAN ports (1 x Intel^® X710-AT2)
1 x Dedicated management port

Total:
8 x 10GbE BASE-T LAN ports (1 x Intel^® X710-AT2)
4 x Dedicated management port

* CMC: Chassis Management Controller, to monitor all status of computing nodes

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Audio

N/A

Storage

Per node:
6 x SATA/SAS/Gen4 NVMe hot-swappable bays
1 x SATA DOM

Total:
24 x SATA/SAS/Gen4 NVMe hot-swappable bays
4 x SATA DOMs

SAS card is required for SAS devices support

SAS

N/A

RAID

Intel^® SATA RAID 0/1/5/10

Peripheral Drives

N/A

Expansion Slots

Per node:
Riser Card CRSH01D:
- 1 x Half-length low-profile slot with PCIe x16 (Gen4 x16 bus)

Riser Card CRSH01E:
- 1 x Half-length low-profile slots with PCIe x16 (Gen4 x16 bus)

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bus*

Total:
8 x Half-length low-profile slots with PCIe x16 (Gen4 x16 bus)
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bus*

*NOTE: OCP 2.0 bandwidth is shared with onboard LAN, if need OCP 2.0 Gen3 x16 bandwidth, onboard LAN would be disabled.

Internal I/O

Per node:
1 x COM header
1 x SATA 7-pin connectors
1 x TPM header
1 x VROC connector
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button

*1 x CMC Status LED
*1 x CMC Reset button

*Only one CMC Status LED and Reset button per system

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC global management port

*Only one CMC global management port per system

Backplane I/O

Front side_CBPH7O0: 24 x SATA/SAS/Gen4 NVMe ports Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s or PCIe Gen4 x4 per port

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

2 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input:
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A

NOTE:
* The system power supply requires C19 type power cord

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Windows Server 2016
Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later

Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Citrix Hypervisor 8.2.0 or later

System Fans

8 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 30°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Please leave one PCIe slot empty if using processor with 270W TDP

Packaging Dimensions

1180 x 779 x 300 (mm)

Packaging Content

1 x H262-NO0
8 x CPU heatsinks
1 x Rail Kit

Part Numbers

- Barebone package: 6NH262NO0MR-00
- Motherboard: 9MH62HD1NR-00
- VROC module: 25FD0-R181N0-10R
(Supported for Intel SSD only, optional)
- Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-453212-M1R/25ST1-453213-M1R
- M.2 extension card: 9CMTP16ZNR-00 (optional)
- Back plane board: 9CBPH7O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- Ring topology kit: 6NH262Z65SR-00-100 (optional)

SUPPORT

下载

驱动程序
BIOS
工具程序
Firmware

使用手冊
支持列表

Online Support

All
All
Windows Server 2022
Windows Server 2019
Windows Server 2016 64bit
Linux

芯片组

版本

档案大小

日期

Intel^® Chipset Driver

Version : 10.1.18612.8252

3.08 MB

2021/06/10

H262-NO0 (rev. 100)

SPECIFICATIONS

SUPPORT

RESOURCES

H262-NO0 (rev. 100)