* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 4 Nodes - Rear access
440 x 87.5 x 840
Motherboard
MP62-HD0
CPU
Ampere® Altra® Max or Altra® Processor
Dual processors, 7nm technology
Up to 128-core per processor, TDP up to 250W

NOTE:
If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
Per Node:
2 x LGA 4926
Total:
8 x LGA 4926
Chipset
System on Chip
Memory
Per node:
16 x DIMM slots

Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory per processor architecture
RDIMM modules up to 256GB supported
LRDIMM modules up to 256GB supported
Up to 4TB of memory capacity supported per processor
Memory speed: Up to 3200 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port

*CMC: Chassis Management Controller, to monitor all status of computing nodes
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Audio
N/A
Storage
Per node:
2 x 2.5" SATA hot-swappable HDD/SSD bays

Total:
8 x 2.5" SATA hot-swappable HDD/SSD bays
SAS
N/A
RAID
N/A
Peripheral Drives
N/A
Expansion Slots
Per node:
2 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
1 x OCP 3.0 mezzanine slot with PCIe Gen4 x8 or x16 bandwidth*

1 x M.2 slot:
- M-key
- PCIe Gen4 x4
- Supports 2280/22110 cards

Total:
8 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
4 x OCP 3.0 mezzanine slot with PCIe Gen4 x8 or x16 bandwidth*

4 x M.2 slots:
- M-key
- PCIe Gen4 x4
- Supports 2280/22110 cards

NOTE: Gen4 x16 available for Ampere Altra Max processor only
Internal I/O
Per node:
1 x M.2 slot
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x System reset button
*1 x CMC status LED

*Only one CMC status LED per system
Rear I/O
Per node:
2 x USB 3.2 Gen1
1 x mini-DP
2 x RJ45
1 x RJ45 MLAN

Total:
8 x USB 3.2 Gen1
4 x Mini DP
8 x RJ45
4 x RJ45 MLAN
*1 x CMC global management port

*Only one CMC global management port per system
Backplane I/O
Total 8 x ports, each node handles 2 x ports
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s per port
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
2 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input:
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+12.12V/ 178.1A
+12Vsb/ 3.5A

System power supply requires C19 type power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Red Hat Enterprise Linux 8.3 ( aarch64 ) or later
Red Hat Enterprise Linux 8.5 ( aarch64 ) or later

SUSE Linux Enterprise Server 15 SP2 ( aarch64 ) or later
SUSE Linux Enterprise Server 15 SP3 ( aarch64 ) or later

Ubuntu 18.04.5 LTS ( aarch64 ) or later
Ubuntu 20.04.1 LTS ( aarch64 ) or later
Ubuntu 22.04 LTS ( aarch64 ) or later

Fedora Server 33-1.2 ( aarch64 ) or later
Fedora Server 35-1.2 ( aarch64 ) or later

OracleLinux R8 U2
OracleLinux R8 U5

Debian 10.9 (Buster)
Debian 11.1
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H262-P61
8 x CPU heatsinks
1 x Rail Kit
Part Numbers
Barebone package: 6NH262P61MR-00
Spare parts:
- Motherboard: 9MP62HD0NR-00
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-45320B-A3R/25ST1-45320C-C1R
- Back plane board: 9CBPH080NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (in option)
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (in option)
- Ring topology kit: 6NH262Z65SR-00-100 (in option)
- Mini-DP to D-Sub cable: 25CRN-200801-K1R (in option)
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.59
111.38 MB
2022/11/07
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022

RESOURCES

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