High Density Server - AMD EPYC™ 7003/7002 - 2U 4-Node DP 8-Bay Gen3 NVMe/SATA
- 2U 4-node rear access server system
- Dual AMD EPYC™ 7003/7002 Series Processors per node
- 8-Channel DDR4 RDIMM/LRDIMM, 64 x DIMMs
- 8 x 1Gb/s LAN ports via Intel® I350-AM2
- 1 x CMC port
- 8 x 2.5" Gen3 NVMe/SATA hot-swappable bays
- 8 x M.2 slots with PCIe Gen3 x4 interface
- 8 x LP PCIe Gen4 x16 slots
- 4 x OCP 2.0 Gen3 x16 mezzanine slots
- Dual 2200W 80 PLUS Platinum redundant power supply
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
440 x 87.5 x 840
Motherboard
MZ62-HD0 Rev. 3.0
CPU
AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Dual processor per node, 7nm technology
Up to 64 cores, 128 threads per processor
TDP up to 225W, cTDP up to 240W
Supports cTDP 280W at ambient 25°C
Note:
1) If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
2) Contact GIGABYTE sales rep or technical support for more details about supporting 240W - 280W CPU.
AMD EPYC™ 7002 Series Processors
Dual processor per node, 7nm technology
Up to 64 cores, 128 threads per processor
TDP up to 225W, cTDP up to 240W
Supports cTDP 280W at ambient 25°C
Note:
1) If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
2) Contact GIGABYTE sales rep or technical support for more details about supporting 240W - 280W CPU.
Socket
Per Node:
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200 MT/s
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200 MT/s
LAN
Per node:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management port
Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x 10/100/1000 Mbps Management ports
1 x CMC port
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management port
Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x 10/100/1000 Mbps Management ports
1 x CMC port
Video
Integrated in Aspeed® AST2500 x 4
- 4 x VGA ports
- 4 x VGA ports
Storage
Per node:
2 x 2.5" Gen3 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)
Total:
8 x 2.5" Gen3 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)
2 x 2.5" Gen3 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)
Total:
8 x 2.5" Gen3 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
2 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
8 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
2 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
8 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Internal I/O
Per node:
1 x TPM header
1 x TPM header
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*Only one CMC status LED per system.
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
*1 x CMC status LED
*Only one CMC status LED per system.
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
*1 x CMC port
*Only one CMC port per system.
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input: - 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A - Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note: System power supply requires C19 power cord.
AC Input: - 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A - Max 2200W/ 200-240V~ or 240Vdc Input
+12.12V/ 178.1A
+12Vsb/ 3.5A
Note: System power supply requires C19 power cord.
System Management
Aspeed® AST2500 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later
Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 47.63 kg
Gross Weight: 49.63 kg
Gross Weight: 49.63 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H262-Z63
8 x CPU heatsinks
1 x 3-Section Rail kit
8 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH262Z63MR-00-A*
- Motherboard: 9MZ62HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Backplane board - CBPH080: 9CBPH080NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP04R: 9CMTP04RNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262Z63SR-RMA-A100
- Motherboard: 9MZ62HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Backplane board - CBPH080: 9CBPH080NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP04R: 9CMTP04RNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262Z63SR-RMA-A100
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
SUPPORT
驱动程序
BIOS
工具程序
Firmware
QVL
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
芯片组
网卡
BIOS
说明
版本
档案大小
日期
1) Updated to AGESA RomePI 1.0.0.J.
2) Updated to AGESA MilanPI 1.0.0.D.
3) Included multiple security updates.
2) Updated to AGESA MilanPI 1.0.0.D.
3) Included multiple security updates.
Version : M20_R34
35.35 MB
Nov 04, 2024
1) Fixed PKfail Vulnerability.
2) Optimized BcpPro tool compatibility.
2) Optimized BcpPro tool compatibility.
Version : M17_R31
35.29 MB
Aug 26, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.
什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.
什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
说明
版本
档案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.21
105.38 MB
Apr 11, 2024
英语
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
英语
使用手册
说明
版本
档案大小
日期
说明
版本
档案大小
日期
RESOURCES
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