H262-ZL0
HPC Server - AMD EPYC™ 7003 - 2U 4-Node DP 24-Bay Gen4 NVMe/SATA DLC
- Hardware-level root of trust support
- Direct liquid cooling solution
- 2U 4-node rear access server system
- AMD EPYC™ 7003 Series processors
- Dual processor per node, 7nm technology
- 8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
- 8 x 1Gb/s LAN ports (Intel® I350-AM2)
- 4 x Dedicated management ports
- 1 x CMC port
- 24 x 2.5" Gen4 NVMe/SATA hot-swappable bays
- 4 x M.2 slots with PCIe Gen4 x4 interface
- 4 x LP PCIe Gen4 x16 slots
- 4 x OCP 3.0 Gen4 x16 slots
- Dual 2200W (240V) 80 PLUS Platinum redundant power supply
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
440 x 87.5 x 840
Motherboard
MZ62-HD4 Rev. 3.0
CPU
AMD EPYC™ 7003 Series processors
Dual processor per node, 7nm technology
Up to 64-core, 128 threads per processor
cTDP up to 280W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Compatible with AMD EPYC™ 7002 Series processors
Dual processor per node, 7nm technology
Up to 64-core, 128 threads per processor
cTDP up to 280W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Compatible with AMD EPYC™ 7002 Series processors
Socket
Per Node:
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x Dedicated management ports
1 x CMC port
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x Dedicated management ports
1 x CMC port
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
6 x 2.5" Gen4 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)
Total:
24 x 2.5" Gen4 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)
6 x 2.5" Gen4 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)
Total:
24 x 2.5" Gen4 NVMe/SATA hot-swappable bays
- (NVMe from CPU_1, SATA from CPU_0)
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth, from CPU_0
4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0
1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0
1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth, from CPU_0
4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports 2280/22110 cards
Internal I/O
Per node:
1 x M.2 slot
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x M.2 slot
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system
Rear I/O
Per node:
2 x USB 3.0
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x Mini-DP
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system
2 x USB 3.0
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x Mini-DP
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input:
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: System power supply requires C19 power cord
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: System power supply requires C19 power cord
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage/Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
System Fans
4 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Weight
Net Weight: 27.2 kg
Packaging Dimensions
1180 x 700 x 465 mm
Packaging Content
1 x H262-ZL0
4 x CPU liquid cooling kits
1 x 3-Section Rail kit
4 x CPU liquid cooling kits
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH262ZL0MR-00-1*
- Motherboard: 9MZ62HD4NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU liquid cooling kit: 25ST7-200002-C4R
- Backplane board - CBPH7O0: 9CBPH7O0NR-00
- Fan module: 25ST2-883828-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH262Z65SR-00-100
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- RMA packaging: 6NH262ZL0SR-RMA-A100
- Motherboard: 9MZ62HD4NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU liquid cooling kit: 25ST7-200002-C4R
- Backplane board - CBPH7O0: 9CBPH7O0NR-00
- Fan module: 25ST2-883828-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Ring topology kit: 6NH262Z65SR-00-100
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- RMA packaging: 6NH262ZL0SR-RMA-A100
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。
SUPPORT
驱动程序
BIOS
工具程序
Firmware
QVL
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
芯片组
网卡
BIOS
说明
版本
档案大小
日期
1) Updated to AGESA RomePI 1.0.0.J.
2) Updated to AGESA MilanPI 1.0.0.D.
3) Included multiple security updates.
2) Updated to AGESA MilanPI 1.0.0.D.
3) Included multiple security updates.
Version : M22_R35
35.39 MB
Nov 04, 2024
1) Fixed PKfail Vulnerability.
2) Optimized BcpPro tool compatibility.
2) Optimized BcpPro tool compatibility.
Version : M21_R34
35.38 MB
Aug 26, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.
什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.
什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.77
147.89 MB
Sep 27, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
说明
版本
档案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.83.50
104.38 MB
Sep 27, 2024
英语
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
英语
使用手册
说明
版本
档案大小
日期
说明
版本
档案大小
日期
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