H263-S64 (rev. AAW1)

(rev.AAN1)

High Density Server – 4th Gen. Intel Xeon Scalable Server DP 8 x Gen4 NVMe/SATA/SAS | Application: 超融合服务器 & 混合/私有云服务器

Application:

超融合服务器混合/私有云服务器

2U 4-node rear access server system
4th Gen. Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series
Dual processor, LGA 4677
8-Channel RDIMM DDR5 per processor, 64 x DIMMs
Dual ROM Architecture supported
4 x Dedicated management ports
1 x CMC port
8 x 2.5" Gen4 NVMe/SATA hot-swappable bays
4 x M.2 slots with PCIe Gen4 x4 interface (optional)
4 x LP PCIe Gen5 x16 slots
4 x OCP 3.0 Gen5 x16 mezzanine slots
Dual 3000W (240V) 80 PLUS Titanium redundant power supply

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* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 840

Motherboard

MS63-HD1

CPU

4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series
Intel^® Xeon^® Platinum Processor, Intel^® Xeon^® Gold Processor, Intel^® Xeon^® Silver Processor
Dual processor, CPU TDP up to 350W

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Socket

Per Node:
2 x LGA 4677

Total:
8 x LGA 4677

Socket E

Chipset

Intel^® C741 Chipset

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz

LAN

Per node:
1 x Dedicated management port

Total:
4 x Dedicated management ports

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Storage

Per node:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays

Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

SAS

Supported via add-on SAS Card

RAID

Intel^® SATA RAID 0/1

Expansion Slots

Per node:
Riser Card CRSH01U
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0

1 x OCP 3.0 mezzanine slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function

*1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports NGFF-2280/22110 cards

Total:
Riser Card CRSH01U x 4
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0

4 x OCP 3.0 mezzanine slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function

*4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports NGFF-2280/22110 cards

*Optional kit for M.2 extension riser card
PN: 9CMTP061NR-00

Internal I/O

Per node:
1 x TPM header
1 x VROC connector

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system

Rear I/O

Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x RJ45 MLAN
1 x ID button with LED

Total:
8 x USB 3.2 Gen1
4 x VGA
4 x RJ45 MLAN
4 x ID buttons with LED
*1 x CMC port

*Only one CMC port per system

Backplane I/O

Backplane P/N: 9CBPH081NR-00
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W (240V) 80 PLUS Titanium redundant power supply
Available for 2+1 redundant power supply configuration (optional)

AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz

DC Input:
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+ 12.2V/ 98.36A
+ 12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+ 12.2V/ 213A
+ 12.2Vsb/ 3A
- Max 3000W/ 208-240V~
+ 12.2V/ 245.9A
+ 12.2Vsb/ 3A

NOTE: The system power supply requires C19 power cord

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x80mm (16,500rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1179 x 700 x 380 mm

Packaging Content

1 x H263-S64
8 x CPU heatsinks
24 x Carrier clips
1 x Rail Kit

Part Numbers

- Barebone package: 6NH263S64DR000AAW1*
- Motherboard: 9MS63HD1UR-000
- Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-453200-A0R/25ST1-453208-C1R
- M.2 extension riser card: 9CMTP061NR-00 (optional)
- Backplane board: 9CBPH081NR-00
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01U: 9CRSH01UNR-00
- Ring topology kit: 6NH263S62S1000AAN11 (optional, QPA:1)
- Power Supply: 25EP0-230009-L0S
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)

SUPPORT

下载

驱动程序
BIOS
工具程序
Firmware

使用手冊
支持列表

Online Support

All
All
Windows Server 2022
Windows Server 2019
Linux

芯片组

版本

档案大小

日期

Intel^® Chipset Driver

Version : 10.1.19263.8344

3.5 MB

2023/01/16

H263-S64 (rev. AAW1)

SPECIFICATIONS

SUPPORT

RESOURCES

H263-S64 (rev. AAW1)