High Density Server - 4th Gen Intel® Xeon® - 2U 4-Node DP 8-Bay Gen4 NVMe/SATA/SAS
| Application:
超融合服务器
&
混合/私有云服务器
- 2U 4-node rear access server system
- 4th Gen Intel® Xeon® Scalable Processors
- Intel® Xeon® CPU Max Series
- Dual processor, LGA 4677
- 8-Channel RDIMM DDR5 per processor, 64 x DIMMs
- Dual ROM Architecture
- 4 x Dedicated management ports
- 1 x CMC port
- 8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
- 4 x M.2 slots with PCIe Gen4 x4 interface (optional)
- 4 x LP PCIe Gen5 x16 slots
- 4 x OCP 3.0 Gen5 x16 slots
- Dual 3000W (240V) 80 PLUS Titanium redundant power supply
1/6
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
440 x 87.5 x 840
Motherboard
MS63-HD1
CPU
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
Dual processor, CPU TDP up to 350W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Intel® Xeon® CPU Max Series
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
Dual processor, CPU TDP up to 350W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
Per Node:
2 x LGA 4677
Total:
8 x LGA 4677
Socket E
2 x LGA 4677
Total:
8 x LGA 4677
Socket E
Chipset
Intel® C741 Chipset
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
16 x DIMM slots
Total:
64 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
LAN
Per node:
1 x Dedicated management port
Total:
4 x Dedicated management ports
1 x CMC port
1 x Dedicated management port
Total:
4 x Dedicated management ports
1 x CMC port
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1
Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1
SAS card is required for SAS devices support
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1
Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1
SAS card is required for SAS devices support
SAS
Depends on SAS Add-on card
RAID
Intel® SATA RAID 0/1
Expansion Slots
Per node:
Riser Card CRSH01U:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
*1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards
Total:
Riser Card CRSH01U x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function
*4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards
*Optional kit for M.2 riser card
PN: 9CMTP061NR-00
Riser Card CRSH01U:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
*1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards
Total:
Riser Card CRSH01U x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function
*4 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports 2280/22110 cards
*Optional kit for M.2 riser card
PN: 9CMTP061NR-00
Internal I/O
Per node:
1 x TPM header
1 x VROC connector
1 x OCP 3.0 slot
1 x TPM header
1 x VROC connector
1 x OCP 3.0 slot
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system
Rear I/O
Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x RJ45 MLAN
1 x ID button with LED
Total:
8 x USB 3.2 Gen1
4 x VGA
4 x RJ45 MLAN
4 x ID buttons with LED
*1 x CMC port
*Only one CMC port per system
2 x USB 3.2 Gen1
1 x VGA
1 x RJ45 MLAN
1 x ID button with LED
Total:
8 x USB 3.2 Gen1
4 x VGA
4 x RJ45 MLAN
4 x ID buttons with LED
*1 x CMC port
*Only one CMC port per system
Backplane I/O
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
Dual 3000W (240V) 80 PLUS Titanium redundant power supply
Available for 2+1 redundant power supply configuration (optional)
AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz
DC Input:
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+ 12.2V/ 98.36A
+ 12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+ 12.2V/ 213A
+ 12.2Vsb/ 3A
- Max 3000W/ 208-240V~
+ 12.2V/ 245.9A
+ 12.2Vsb/ 3A
NOTE: The system power supply requires C19 power cord
Available for 2+1 redundant power supply configuration (optional)
AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz
DC Input:
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+ 12.2V/ 98.36A
+ 12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+ 12.2V/ 213A
+ 12.2Vsb/ 3A
- Max 3000W/ 208-240V~
+ 12.2V/ 245.9A
+ 12.2Vsb/ 3A
NOTE: The system power supply requires C19 power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Windows Server 2022 (x64)
Additional certifications:
Windows Server 2022 (x64)
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1179 x 700 x 380 mm
Packaging Content
1 x H263-S64
8 x CPU heatsinks
24 x Carrier clips
1 x 3-Section Rail kit
8 x CPU heatsinks
24 x Carrier clips
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH263S64DR000AAW1*
- Motherboard: 9MS63HD1UR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-453200-A0R/25ST1-453208-C1R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH081: 9CBPH081NR-00
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01U: 9CRSH01UNR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Power Supply: 25EP0-230009-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00
- Ring topology kit: 6NH263S62S1000AAN11 (QPA:1)
- Motherboard: 9MS63HD1UR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-453200-A0R/25ST1-453208-C1R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH081: 9CBPH081NR-00
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01U: 9CRSH01UNR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Power Supply: 25EP0-230009-L0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00
- Ring topology kit: 6NH263S62S1000AAN11 (QPA:1)
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SUPPORT
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
芯片组
芯片组
版本
档案大小
日期
Intel® Chipset Driver
Version : 10.1.19263.8344
3.5 MB
Jan 16, 2023
操作系统: Windows Server 2019,Windows Server 2022
SATA RAID/AHCI
SATA RAID/AHCI
版本
档案大小
日期
Intel® SATA RAID Utility
Version : 8.0.0.4035
122.34 MB
Jan 17, 2023
操作系统: Windows Server 2019,Windows Server 2022
公用程式
公用程式
版本
档案大小
日期
Intel® QuickAssist Technology
Version : 2.0.1-0016
37.36 MB
Jan 17, 2023
操作系统: Linux,Windows Server 2019,Windows Server 2022
BIOS
说明
版本
档案大小
日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
注意:
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.64
111.38 MB
Sep 05, 2023
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
说明
版本
档案大小
日期
BMC Firmware with embedded GIGABYTE Management Console
(AST2600 AMI)
(AST2600 AMI)
Version : 13.05.07
112.97 MB
Sep 27, 2023
英语
BMC Firmware (AST2520) for CMC module
NOTE: Please make sure 2U-4Node system CMC firmware version is 12.40.19 or later before updating BMC firmware
NOTE: Please make sure 2U-4Node system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.25
81.64 MB
Aug 25, 2023
英语
使用手冊
说明
版本
档案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
17.39 MB
Aug 29, 2023
英语
Back to H263-S64
