H263-V60
(rev. LAW1)
High Density Arm Server - NVIDIA Grace CPU Superchip - 2U 4-Node 16-Bay Gen5 NVMe DLC
- Direct liquid cooling solution
- High-performance CPU for HPC and cloud computing
- 2U 4-node rear access server system
- NVIDIA Grace CPU Superchip
- 900GB/s NVLink-C2C Interconnect
- Up to 960GB LPDDR5X ECC memory per module
- Compatible with NVIDIA BlueField®-3 DPUs
- 4 x Dedicated management ports
- 16 x 2.5" Gen5 NVMe hot-swappable bays
- 8 x M.2 slots with PCIe Gen5 x4 interface
- 4 x FHHL PCIe Gen5 x16 slots
- 4 x OCP 3.0 Gen5 x16 slots
- 2+1 3000W 80 PLUS Titanium redundant power supplies
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 850
440 x 87.5 x 850
Motherboard
MV63-HD0
Superchip
NVIDIA Grace CPU Superchip:
- 2 x Grace CPUs
- Connected with NVLink-C2C
- TDP up to 500W (CPU + memory)
- 2 x Grace CPUs
- Connected with NVLink-C2C
- TDP up to 500W (CPU + memory)
Memory
Per node:
Up to 960GB of LPDDR5X memory with ECC
Memory bandwidth up to 1TB/s
Up to 960GB of LPDDR5X memory with ECC
Memory bandwidth up to 1TB/s
LAN
Per node:
1 x Dedicated management port
Total:
4 x Dedicated management ports
1 x CMC port
1 x Dedicated management port
Total:
4 x Dedicated management ports
1 x CMC port
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
4 x 2.5" Gen5 NVMe hot-swappable bays
- (2 x from CPU_0, 2 x from CPU_1)
Total:
16 x 2.5" Gen5 NVMe hot-swappable bays
- (8 x from CPU_0, 8 x from CPU_1)
4 x 2.5" Gen5 NVMe hot-swappable bays
- (2 x from CPU_0, 2 x from CPU_1)
Total:
16 x 2.5" Gen5 NVMe hot-swappable bays
- (8 x from CPU_0, 8 x from CPU_1)
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
PCIe cable:
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU_1
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
2 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Supports 2280/22110 cards
Total:
PCIe cable x 4:
- 4 x PCIe x16 (Gen5 x16) FHHL slots, from CPU_1
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function
8 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Supports 2280/22110 cards
PCIe cable:
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU_1
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
2 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Supports 2280/22110 cards
Total:
PCIe cable x 4:
- 4 x PCIe x16 (Gen5 x16) FHHL slots, from CPU_1
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function
8 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Supports 2280/22110 cards
Internal I/O
Per node:
1 x TPM header
1 x TPM header
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system.
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system.
Rear I/O
Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED
Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port
*Only one CMC port per system.
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED
Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
PCIe Gen5 x4
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM012
Optional TPM2.0 kit: CTM012
Power Supply
2+1 3000W 80 PLUS Titanium redundant power supplies
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
Note: The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
TBD
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 10-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-90% (non-condensing)
Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Operating humidity: 10-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-90% (non-condensing)
Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H263-V60
1 x 3-Section Rail kit
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH263V60MR000LAW1*
- 3-Section Rail kit: 25HB2-A66125-K0R
Optional parts:
- GIGABYTE Superchip coldplate loop: 25H26-3V60000-E43X (QPA:4)
- GIGABYTE 2U4N Manifold: 25H27-3Z80000-E07X (1 set per rack)
- 3-Section Rail kit: 25HB2-A66125-K0R
Optional parts:
- GIGABYTE Superchip coldplate loop: 25H26-3V60000-E43X (QPA:4)
- GIGABYTE 2U4N Manifold: 25H27-3Z80000-E07X (1 set per rack)
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SUPPORT
Firmware
OS
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