H273-Z81 (rev. AAW1)

(rev.AAN1)

High Density Server – AMD EPYC™ 9004 DP 2U 4-Node Server 8 x Gen4 NVMe/SATA 3000W | Application: 超融合服务器 & 混合/私有云服务器

Application:

超融合服务器混合/私有云服务器

2U 4-node rear access server system
AMD EPYC™ 9004 series processor family
Dual processors per node, 5nm technology
12-Channel RDIMM DDR5 per processor, 96 x DIMMs
Dual ROM Architecture supported
8 x 1Gb/s LAN ports (Intel^® I350-AM2)
4 x Dedicated management ports
8 x 2.5" Gen4 NVMe / SATA hot-swappable bays
4 x M.2 with PCIe Gen4 x4 interface (optional)
8 x Low profile PCIe Gen5 x16 expansion slots
4 x OCP 3.0 Gen5 x16 mezzanine slots
Dual 3000W (240V) 80 PLUS Titanium redundant power supply

加入比较表

1/7

* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 877

Motherboard

MZ83-HD0

CPU

AMD EPYC™ 9004 series processor family
Dual processors, 5nm technology
Up to 96-core, 192 threads per processor
Supports CPU 300W at ambient 25°C

Socket

Per Node:
2 x LGA 6096
Total:
8 x LGA 6096

Socket SP5

Chipset

System on Chip

Memory

Per node:
24 x DIMM slots

Total:
96 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 128GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz

LAN

Per node:
2 x 1GbE LAN ports (1 x Intel^® I350-AM2)
Supported NCSI function
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel^® I350-AM2)
Supported NCSI function
4 x Dedicated management ports

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Audio

N/A

Storage

Per node:
2 x 2.5" Gen4 NVMe / SATA / SAS hot-swappable bays

Total:
8 x 2.5" Gen4 NVMe / SATA / SAS hot-swappable bays

SAS card is required for SAS devices support

SAS

Supported via add-on SAS Card

RAID

N/A

Peripheral Drives

N/A

Expansion Slots

Per node:
2 x Low profile half-length slots with PCIe x16 (Gen5 x16 bus), from CPU_0
1 x OCP 3.0 mezzanine slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supported NCSI function

*1 x M.2 slot from CPU_0:
- M-key
- PCIe Gen4 x4
- Supports NGFF-2280/22110 cards

Total:
8 x Low profile half-length slots with PCIe x16 (Gen5 x16 bus) from CPU_0
4 x OCP 3.0 mezzanine slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supported NCSI function

*4 x M.2 slots from CPU_0:
- M-key
- PCIe Gen4 x4
- Supports NGFF-2280/22110 cards

*Optional kit for M.2 extension riser card
PN: 9CMTP192NR-00

Internal I/O

Per node:
1 x TPM header

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x System reset button
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system

Rear I/O

Per node:
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x RJ45 MLAN
1 x Node Status LED

Total:
8 x USB 3.2 Gen1
4 x Mini-DP
8 x RJ45
4 x RJ45 MLAN
4 x Node Status LED

Backplane I/O

Backplane P/N: 9CBPH081NR-00
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W (240V) 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz

DC Input:
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+ 12.2V/ 98.36A
+ 12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+ 12.2V/ 213A
+ 12.2Vsb/ 3A
- Max 3000W/ 208-240V~
+ 12.2V/ 245.9A
+ 12.2Vsb/ 3A

NOTE: The system power supply requires C19 type power cord

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Certification for VMware 8.0
Certification for Citrix Hypervisor 8.2.1

System Fans

4 x 80x80x80mm (16,500rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1179 x 700 x 380 mm

Packaging Content

1 x H273-Z81
8 x CPU heatsinks
1 x Rail Kit

Part Numbers

- Barebone package: 6NH273Z81DR000AAW1*
- Motherboard: 9AZ83HD0UR-000
- Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-25320N-M1R/25ST1-25320Q-M1R
- M.2 extension riser card: 9CMTP192NR-00 (optional)
- Back plane board: 9CBPH081NR-00
- Fan module: 25ST2-888020-S1R
- Rear IO board (incl. LAN chip): 9CLBH160NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power Supply: 25EP0-230009-L0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)

SUPPORT

下载

驱动程序
BIOS
工具程序
Firmware

使用手冊
支持列表

Online Support

All
All
Windows Server 2022
Windows Server 2019

芯片组

版本

档案大小

日期

AMD Chipset Driver

Version : 4.06.27.500

16.58 MB

2022/11/11

H273-Z81 (rev. AAW1)

SPECIFICATIONS

SUPPORT

RESOURCES

H273-Z81 (rev. AAW1)