* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 877
Motherboard
MZ83-HD0
CPU
AMD EPYC™ 9004 series processor family
Dual processors, 5nm technology
Up to 96-core, 192 threads per processor
Supports CPU 400W at ambient 25°C*

NOTE: CPU 240W at ambient 25°C if using OCP 3.0 slot
Socket
Per Node:
2 x LGA 6096
Total:
8 x LGA 6096

Socket SP5
Chipset
System on Chip
Memory
Per node:
24 x DIMM slots

Total:
96 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 128GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Supported NCSI function
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
Supported NCSI function
4 x Dedicated management ports
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Audio
N/A
Storage
Per node:
2 x 2.5" Gen4 NVMe / SATA / SAS hot-swappable bays

Total:
8 x 2.5" Gen4 NVMe / SATA / SAS hot-swappable bays

SAS card is required for SAS devices support
SAS
Supported via add-on SAS Card
RAID
N/A
Peripheral Drives
N/A
Expansion Slots
Per node:
1 x Low profile half-length slots with PCIe x16 (Gen5 x16 bus), from CPU_0
1 x OCP 3.0 mezzanine slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supported NCSI function

*1 x M.2 slot from CPU_0:
- M-key
- PCIe Gen4 x4
- Supports NGFF-2280/22110 cards

Total:
4 x Low profile half-length slots with PCIe x16 (Gen5 x16 bus) from CPU_0
4 x OCP 3.0 mezzanine slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supported NCSI function

*4 x M.2 slots from CPU_0:
- M-key
- PCIe Gen4 x4
- Supports NGFF-2280/22110 cards

*Optional kit for M.2 extension riser card
PN: 9CMTP192NR-00
Internal I/O
Per node:
1 x TPM header
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x System reset button
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system
Rear I/O
Per node:
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x RJ45 MLAN
1 x Node Status LED

Total:
8 x USB 3.2 Gen1
4 x Mini-DP
8 x RJ45
4 x RJ45 MLAN
4 x Node Status LED
Backplane I/O
Backplane P/N: 9CBPH081NR-00
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
Dual 3000W (240V) 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz

DC Input:
- 240Vdc/ 16A

DC Output:
- Max 1200W/ 100-127V~
+ 12.2V/ 98.36A
+ 12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+ 12.2V/ 213A
+ 12.2Vsb/ 3A
- Max 3000W/ 208-240V~
+ 12.2V/ 245.9A
+ 12.2Vsb/ 3A

NOTE: The system power supply requires C19 type power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS / BMC / CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1179 x 700 x 380 mm
Packaging Content
1 x H273-Z82
8 x CPU heatsinks
1 x Rail Kit
Part Numbers
- Barebone package: 6NH273Z82DR000AAW1*
- Motherboard: 9AZ83HD0UR-000
- Rail kit: 25HB2-A66125-K0R
- CPU heatsink: 25ST1-25320P-M1R/25ST1-25320Q-M1R
- M.2 extension riser card: 9CMTP192NR-00 (optional)
- Back plane board: 9CBPH081NR-00
- Fan module: 25ST2-888020-S1R
- Rear IO board (incl. LAN chip): 9CLBH160NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power Supply: 25EP0-230009-L0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.60
111.39 MB
2023/01/18
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手冊
说明
版本
档案大小
日期

RESOURCES

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