R133-C11
(rev. AAG1)

Rack Server - AMD Ryzen™ 7000 - 1U UP 8-Bay SATA
  • Supports 1 x Dual slot Gen5 GPU card
  • AMD Ryzen™ 7000 Series processors
  • AMD Ryzen™ 7000 Series processors with AMD 3D V-Cache™ Technology
  • Single processor, 5nm technology
  • Dual Channel ECC/Non-ECC DDR5 Unbuffered DIMM, 4 x DIMMs
  • 2 x 10Gb/s LAN ports (Broadcom® BCM57416)
  • 2 x 1Gb/s LAN ports (Broadcom® BCM5720)
  • 1 x Dedicated management port
  • 4 x 3.5"/2.5" SATA hot-swappable bays
  • 4 x 2.5" 7mm SATA hot-swappable bays
  • 1 x M.2 slot with PCIe Gen4 x4 interface
  • 1 x FHFL PCIe Gen5 x16 slot for GPUs
  • 1 x FHHL PCIe Gen4 x4 slot
  • 1+1 800W (240V) 80 PLUS Titanium redundant power supplies
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
1U
438 x 43.5 x 710
Motherboard
MC13-BL0
CPU
AMD Ryzen™ 7000 Series processors
AMD Ryzen™ 7000 Series processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
TDP up to 170W

*Overclocking not supported due to thermal limitation.
Socket
AM5
Chipset
AMD B650E
Memory
4 x DIMM slots
DDR5 memory supported only
Dual Channel memory architecture
DIMM modules up to 32GB supported
ECC Unbuffered DIMM 1Rx8/2Rx8 modules supported
Non-ECC Unbuffered DIMM 1Rx8/2Rx8/1Rx16 modules supported
Memory speed: up to 5200 MHz (1DPC), 3600 MHz (2DPC)
LAN
Rear side:
2 x 10Gb/s LAN ports (1 x Broadcom® BCM57416)
2 x 1Gb/s LAN ports (1 x Broadcom® BCM5720)
NCSI function supported on Broadcom® BCM5720 and BCM57416 (by switch)

1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
Front side:
4 x 3.5"/2.5" SATA hot-swappable bays
4 x 2.5" 7mm SATA hot-swappable bays

SATA supported only
SAS
N/A
RAID
RAID 0/1/10
Expansion Slots
PCIe Cable:
- 1 x PCIe x16 (Gen5 x16) FHFL slot, from CPU, for GPUs*

*Max 300W for GPUs

Riser Card CRSE016:
- 1 x PCIe x4 (Gen4 x4) FHHL slot, from CPU

1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from FCH
- Supports 2280/22110 cards
Internal I/O
2 x USB 3.2 Gen1
2 x USB 2.0
1 x Front panel header
1 x Back panel header
2 x Fan headers (4 pin)
1 x M.2 slot
1 x TPM header
1 x PMBus header
Front I/O
1 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x HDD activity LED
1 x System status LED
Rear I/O
2 x USB 3.2 Gen1
1 x Mini-DP
4 x RJ45
1 x MLAN
1 x ID button with LED
Backplane Board
Speed and bandwidth:
SATA 6Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
1+1 800W (240V) 80 PLUS Titanium redundant power supplies

AC Input:
- 100-127V~/ 10A, 50-60Hz
- 200-240V~/ 5A, 50-60Hz

DC Input:
- 240Vdc/ 5A

DC Output:
- Max 800W
+ 12.2V/ 65A
+ 12.2Vsb/ 3A
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Windows 10 21H2 (x64)
Windows 11 (x64)
System Fans
2 x 40x40x56mm (29,700rpm)
3 x 40x40x56mm (32,000rpm)
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 16.8 kg
Gross Weight: 18.8 kg
Packaging Dimensions
977 x 588 x 236 mm
Packaging Content
1 x R133-C11
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
1 x GPU power cable (2x4pin to 2x 2x4pin)
1 x 2-Section Rail kit
Part Numbers
- Barebone package: 6NR133C11MR000AAG1*
- Motherboard: 9MC13BL0NR-000
- 2-Section Rail kit (CMA not supported): 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-443300-S7R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP1010: 9CFP1010NR-00
- Backplane board - CBP1045: 9CBP1045NR-00
- Backplane board - CBP1047: 9CBP1047NR-00
- Fan module: 25ST2-405623-A0R/25ST2-40562H-A0R
- Riser card - CRSE016: 9CRSE01016NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (8+8pin, PCIe): 25CRI-700004-G5R
- Power supply: 25EP0-20800C-G1S

Optional parts:

- 3-Section Rail kit (Supports CMA): 25HB2-A56120-K0R
- Cable Management Arm: 25HBZ-R18100-K0R
* 以上产品之规格、图片及其他信息仅供参考,如与实际产品有任何不相符之处,应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失,技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值,实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示,均为其合法所有人之财产。
* 基于PC基本架构,有部分内存空间须留作系统用途,故所侦测到之内存大小会比实际上较少。

SUPPORT

  • All
  • All
  • Windows 11 64bit
  • Windows 10 64bit
注意:
更新BIOS有其潜在的风险,如果您使用目前版本的BIOS没有问题,我们建议您不要任意更新BIOS。如需更新BIOS,请小心的执行,以避免不当的操作而造成系统毁损.

什么是 BETA 版?
BETA版是正式推出前的试用版本。虽然该版本已经过测试,但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本,并请密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.72
147.86 MB
Mar 05, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
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