R133-C13
(rev. AAG1)
Rack Server - AMD Ryzen™ 7000 - 1U UP 4-Bay SATA
- Supports 1 x Dual slot Gen5 GPU card
- AMD Ryzen™ 7000 Series processors
- AMD Ryzen™ 7000 Series processors with AMD 3D V-Cache™ Technology
- Single processor, 5nm technology
- Dual Channel ECC/Non-ECC DDR5 Unbuffered DIMM, 4 x DIMMs
- 2 x 1Gb/s LAN ports (Broadcom® BCM5720)
- 1 x Dedicated management port
- 4 x 3.5"/2.5" SATA hot-swappable bays
- 1 x M.2 slot with PCIe Gen4 x4 interface
- 1 x FHFL PCIe Gen5 x16 slot for GPUs
- 1 x FHHL PCIe Gen4 x4 slot
- 1+1 800W (240V) 80 PLUS Titanium redundant power supplies
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
1U
438 x 43.5 x 710
438 x 43.5 x 710
Motherboard
MC13-BL1
CPU
AMD Ryzen™ 7000 Series processors
AMD Ryzen™ 7000 Series processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
TDP up to 170W
*Overclocking not supported due to thermal limitation.
AMD Ryzen™ 7000 Series processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
TDP up to 170W
*Overclocking not supported due to thermal limitation.
Socket
AM5
Chipset
AMD B650E
Memory
4 x DIMM slots
DDR5 memory supported only
Dual Channel memory architecture
DIMM modules up to 32GB supported
ECC Unbuffered DIMM 1Rx8/2Rx8 modules supported
Non-ECC Unbuffered DIMM 1Rx8/2Rx8/1Rx16 modules supported
Memory speed: up to 5200 MHz (1DPC), 3600 MHz (2DPC)
DDR5 memory supported only
Dual Channel memory architecture
DIMM modules up to 32GB supported
ECC Unbuffered DIMM 1Rx8/2Rx8 modules supported
Non-ECC Unbuffered DIMM 1Rx8/2Rx8/1Rx16 modules supported
Memory speed: up to 5200 MHz (1DPC), 3600 MHz (2DPC)
LAN
Rear side:
2 x 1Gb/s LAN ports (2 x Broadcom® BCM5720)
Support NCSI function
1 x 10/100/1000 management LAN
2 x 1Gb/s LAN ports (2 x Broadcom® BCM5720)
Support NCSI function
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
Front side:
4 x 3.5"/2.5" SATA hot-swappable bays
SATA supported only
4 x 3.5"/2.5" SATA hot-swappable bays
SATA supported only
SAS
N/A
RAID
RAID 0/1/10
Expansion Slots
PCIe Cable:
- 1 x PCIe x16 (Gen5 x16) FHFL slot, from CPU, for GPUs*
*Max 300W for GPUs
Riser Card CRSE016:
- 1 x PCIe x4 (Gen4 x4) FHHL slot, from CPU
1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from FCH
- Supports 2280/22110 cards
- 1 x PCIe x16 (Gen5 x16) FHFL slot, from CPU, for GPUs*
*Max 300W for GPUs
Riser Card CRSE016:
- 1 x PCIe x4 (Gen4 x4) FHHL slot, from CPU
1 x M.2 slot:
- M-key
- PCIe Gen4 x4, from FCH
- Supports 2280/22110 cards
Internal I/O
2 x USB 3.2 Gen1
2 x USB 2.0
1 x Front panel header
1 x Back panel header
2 x Fan headers (4 pin)
1 x M.2 slot
1 x TPM header
1 x PMBus header
2 x USB 2.0
1 x Front panel header
1 x Back panel header
2 x Fan headers (4 pin)
1 x M.2 slot
1 x TPM header
1 x PMBus header
Front I/O
2 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x HDD activity LED
1 x System status LED
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
2 x LAN activity LEDs
1 x HDD activity LED
1 x System status LED
Rear I/O
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x ID button with LED
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x ID button with LED
Backplane Board
Speed and bandwidth:
SATA 6Gb/s
SATA 6Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
1+1 800W (240V) 80 PLUS Titanium redundant power supplies
AC Input:
- 100-127V~/ 10A, 50-60Hz
- 200-240V~/ 5A, 50-60Hz
DC Input:
- 240Vdc/ 5A
DC Output:
- Max 800W
+ 12.2V/ 65A
+ 12.2Vsb/ 3A
AC Input:
- 100-127V~/ 10A, 50-60Hz
- 200-240V~/ 5A, 50-60Hz
DC Input:
- 240Vdc/ 5A
DC Output:
- Max 800W
+ 12.2V/ 65A
+ 12.2Vsb/ 3A
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows 10 21H2 (x64)
Windows 11 (x64)
Windows 11 (x64)
System Fans
2 x 40x40x56mm (29,700rpm)
3 x 40x40x56mm (32,000rpm)
3 x 40x40x56mm (32,000rpm)
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 17.82 kg
Gross Weight: 19.82 kg
Gross Weight: 19.82 kg
Packaging Dimensions
977 x 588 x 236 mm
Packaging Content
1 x R133-C13
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
1 x GPU power cable (2x4pin to 2x 2x4pin)
1 x 2-Section Rail kit
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
1 x GPU power cable (2x4pin to 2x 2x4pin)
1 x 2-Section Rail kit
Part Numbers
- Barebone package: 6NR133C13MR000AAG1*
- Motherboard: 9MC13BL1NR-000
- 2-Section Rail kit (CMA not supported): 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-443300-S7R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP1010: 9CFP1010NR-00
- Backplane board - CBP1047: 9CBP1047NR-00
- Fan module: 25ST2-405623-A0R/25ST2-40562H-A0R
- Riser card - CRSE016: 9CRSE01016NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (8+8pin, PCIe): 25CRI-700004-G5R
- Power supply: 25EP0-20800C-G1S
Optional parts:
- 3-Section Rail kit (Supports CMA): 25HB2-A56120-K0R
- Cable Management Arm: 25HBZ-R18100-K0R
- Motherboard: 9MC13BL1NR-000
- 2-Section Rail kit (CMA not supported): 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-443300-S7R
- M.2 heatsink: 12SP2-11000E-00R
- Front panel board - CFP1010: 9CFP1010NR-00
- Backplane board - CBP1047: 9CBP1047NR-00
- Fan module: 25ST2-405623-A0R/25ST2-40562H-A0R
- Riser card - CRSE016: 9CRSE01016NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (8+8pin, PCIe): 25CRI-700004-G5R
- Power supply: 25EP0-20800C-G1S
Optional parts:
- 3-Section Rail kit (Supports CMA): 25HB2-A56120-K0R
- Cable Management Arm: 25HBZ-R18100-K0R
* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。
SUPPORT
驱动程序
BIOS
工具程序
Firmware
QVL
- All
- All
- Windows 11 64bit
- Windows 10 64bit
芯片组
芯片组
版本
档案大小
日期
AMD Chipset Driver
Version : 4.07.13.2243
683.85 MB
Mar 28, 2023
操作系统: Windows 10 64bit,Windows 11 64bit
网卡
网卡
版本
档案大小
日期
Broadcom LAN driver
Version : 1.0
8.04 MB
Mar 28, 2023
操作系统: Windows 10 64bit,Windows 11 64bit
SATA RAID/AHCI
SATA RAID/AHCI
版本
档案大小
日期
AMD RAID driver
Version : 9.3.2.00130
92.4 MB
Mar 28, 2023
操作系统: Windows 10 64bit,Windows 11 64bit
显示介面
显示介面
版本
档案大小
日期
ASPEED Graphic Driver
Version : 1.14
2.55 MB
Jan 16, 2023
操作系统: Windows 10 64bit,Windows 11 64bit
BIOS
说明
版本
档案大小
日期
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
注意:
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
更新BIOS有其潜在的风险，如果您使用目前版本的BIOS没有问题，我们建议您不要任意更新BIOS。如需更新BIOS，请小心的执行，以避免不当的操作而造成系统毁损.
什么是 BETA 版？
BETA版是正式推出前的试用版本。虽然该版本已经过测试，但可能还存在部份尚未发现、可能影响执行效能和功能的小问题。 请注意BETA版非正式的版本，并请密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程序
说明
版本
档案大小
日期
GSM CLI
Version : 2.1.72
147.86 MB
Mar 05, 2024
操作系统: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
操作系统: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
说明
版本
档案大小
日期
BMC firmware with embedded GIGABYTE Management Console
(AST2600)
(AST2600)
Version : 13.05.09
113.83 MB
Jan 26, 2024
英语
使用手冊
说明
版本
档案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
17.39 MB
Aug 29, 2023
英语
说明
版本
档案大小
日期
Back to R133-C13
