R263-S33
(rev. AAL1)

(rev.AAF1)

Rack Server - 4th Gen Intel^® Xeon^® - 2U UP 12-Bay SATA/SAS | Application: 人工智能平台 , 人工智能推理服务器 , 视觉计算 & 高性能计算平台

Application:

人工智能平台人工智能推理服务器视觉计算高性能计算平台

Supports up to 3 x Dual slot Gen5 GPU cards
4th Gen Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series
Single processor, LGA 4677
8-Channel RDIMM DDR5 per processor, 16 x DIMMs
Dual ROM Architecture
1 x 1Gb/s LAN port (Intel^® I210-AT)
1 x Dedicated management port
12 x 3.5"/2.5" SATA/SAS hot-swappable bays
1 x M.2 slot with PCIe Gen3 x4 interface
3 x FHFL PCIe Gen5 x16 slots for GPUs
2 x OCP 3.0 Gen5 x16 slots
1+1 2700W (240V) 80 PLUS Titanium redundant power supplies

加入比较表

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* 以上产品之规格、图片及其他信息仅供参考，如与实际产品有任何不相符之处，应以实际产品为准。技嘉科技保留在任何时间做出修改之权利。对任何因使用上述数据而引致之损失，技嘉科技概不承担任何责任。
* 本产品所标示之各项效能表现为各芯片厂商或各制定接口官方组织所提出的最大理论值，实际效能可能因规格及设备而有所不同。
* 本文中所使用之各项商标及企业识别图示，均为其合法所有人之财产。
* 基于PC基本架构，有部分内存空间须留作系统用途，故所侦测到之内存大小会比实际上较少。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U
438 x 87.5 x 710

Motherboard

MS33-DC0

CPU

4th Generation Intel^® Xeon^® Scalable Processors
Intel^® Xeon^® CPU Max Series
Intel^® Xeon^® Platinum Processor, Intel^® Xeon^® Gold Processor, Intel^® Xeon^® Silver Processor
Single processor, CPU TDP up to 350W

Socket

1 x LGA 4677
Socket E

Chipset

Intel^® C741 Chipset

Memory

16 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz (1DPC), 4400 MHz (2DPC)

LAN

Rear side:
1 x 1Gb/s LAN port (1 x Intel^® I210-AT)
Supports NCSI function

1 x 10/100/1000 management LAN

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Storage

Front side:
12 x 3.5"/2.5" SATA/SAS hot-swappable bays

SAS card is required for SAS devices support

SAS

Depends on SAS Add-on card

RAID

Intel^® SATA RAID 0/1/10/5

Expansion Slots

Riser Card CRS201C:
- 1 x PCIe x16 (Gen5 x16) FHFL slot, from CPU, for GPUs

Riser Card CRS201D:
- 1 x PCIe x16 (Gen5 x16) FHFL slot, from CPU, for GPUs

Riser Card CRS2018:
- 1 x PCIe x16 (Gen5 x16) FHFL slot, from CPU, for GPUs

2 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU
Support NCSI function

1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from PCH
- Supports 2280/22110 cards

Internal I/O

1 x M.2 slot
1 x TPM header
1 x VROC connector
2 x OCP 3.0 slots

Front I/O

2 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x LAN activity LED
1 x HDD activity LED
1 x System status LED

Rear I/O

2 x USB 3.2 Gen1
1 x Mini-DP
1 x RJ45
1 x MLAN
1 x ID button with LED

Backplane I/O

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

1+1 2700W (240V) 80 PLUS Titanium redundant power supplies

AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz

DC Input:
- 240Vdc/ 16A

DC Output:
- Max 1008W/ 100-127V~
+ 12V/ 84A
+ 12Vsb/ 3A
- Max 2700W/ 200-240V~
+ 12V/ 225A
+ 12Vsb/ 3A

NOTE:

1. The system power supply requires C19 power cord
2. The default power supply is based on a basic system configuration. Please contact with technical representatives to determine the best power supply selection for your system configuration requirements and preferred efficiency.

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

Additional certifications:
Windows Server 2022 (x64)

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

989 x 594 x 279 mm

Packaging Content

1 x R263-S33
1 x CPU heatsink
1 x Mini-DP to D-Sub cable
3 x Carrier clips
1 x 2-Section Rail kit

Part Numbers

- Barebone package: 6NR263S33DR000AAL1*
- Motherboard: 9MS33DC0UR-000
- 2-Section Rail kit: 25HB2-3A0203-K0R
- CPU heatsink: 25ST1-4Z3200-S7R
- M.2 heatsink: 12SP2-11000E-00R
- Backplane board - CBP20C5: 9CBP20C5NR-00
- Fan module: 25ST2-88382T-S1R
- Riser card - CRS201C: 9CRS201CNR-00
- Riser card - CRS201D: 9CRS201DNR-00
- Riser card - CRS2018: 9CRS2018NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- GPU power cable (6P+2P) 350mm: 25CRI-350305-Y4R
- GPU power cable (6P+2P) 480mm: 25CRI-480300-Y4R
- Power supply: 25EP0-227000-D0S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- 3-Section Rail kit: 25HB2-A56121-K0R
- Cable Management Arm: 25HB1-R18300-K0R

SUPPORT

下载

驱动程序
BIOS
工具程序
Firmware

使用手冊
支持列表

Online Support

All
All
Windows Server 2022
Windows Server 2019
Linux

芯片组

版本

档案大小

日期

Intel^® Chipset Driver

Version : 10.1.19263.8344

3.5 MB

Jan 16, 2023

R263-S33 (rev. AAL1)

SPECIFICATIONS

SUPPORT

RESOURCES

R263-S33 (rev. AAL1)

R263-S33
(rev. AAL1)